-
4
-
-
0030213930
-
Copper nitride and tin nitride thin films for write-once optical recording media
-
Maruyama, T. &Morishita, T. Copper nitride and tin nitride thin films for writeonce optical recording media. Appl. Phys. Lett. 69, 890-891 (1996). (Pubitemid 126619328)
-
(1996)
Applied Physics Letters
, vol.69
, Issue.7
, pp. 890-891
-
-
Maruyama, T.1
Morishita, T.2
-
5
-
-
33845961206
-
Ternary Cu3NPdx exhibiting invariant electrical resistivity over 200 K
-
Ji, A. L., Li, C. R. & Cao, Z. X. Ternary Cu3NPdx exhibiting invariant electrical resistivity over 200 K. Appl. Phys. Lett. 89, 252120 (2006).
-
(2006)
Appl. Phys. Lett.
, vol.89
, pp. 252120
-
-
Ji, A.L.1
Li, C.R.2
Cao, Z.X.3
-
6
-
-
84862636802
-
First principles study of 3d transition metal doped Cu3N
-
Cui, X. Y. et al. First principles study of 3d transition metal doped Cu3N. J. Magn. Magn. Mater. 324, 3138-3143 (2012).
-
(2012)
J. Magn. Magn. Mater.
, vol.324
, pp. 3138-3143
-
-
Cui, X.Y.1
-
7
-
-
28744453745
-
Copper nitride thin film prepared by reactive radio-frequency magnetron sputtering
-
Yue, G. et al. Copper nitride thin film prepared by reactive radio-frequency magnetron sputtering. J. Appl. Phys. 98, 103506 (2005).
-
(2005)
J. Appl. Phys.
, vol.98
, pp. 103506
-
-
Yue, G.1
-
8
-
-
0035123977
-
Thermal decomposition of copper nitride thin films and dots formation by electron beam writing
-
DOI 10.1016/S0169-4332(00)00681-4
-
Nosaka, T., Yoshitake, M., Okamoto, A., Ogawa, S. & Nakayama, Y. Thermal decomposition of copper nitride thin films and dots formation by electron beam writing. Appl. Surf. Sci. 169, 358-361 (2001). (Pubitemid 32195595)
-
(2001)
Applied Surface Science
, vol.169-170
, pp. 358-361
-
-
Nosaka, T.1
Yoshitake, M.2
Okamoto, A.3
Ogawa, S.4
Nakayama, Y.5
-
9
-
-
0141857718
-
Electrochemistry of Cu3N with lithium a complex system with parallel processes
-
Pereira, N., Dupont, L., Tarascon, J. M., Klein, L. C. & Amatucci, G. G. Electrochemistry of Cu3N with lithium a complex system with parallel processes. J. Electrochem. Soc. 150, A1273-A1280 (2003).
-
(2003)
J. Electrochem. Soc.
, vol.150
-
-
Pereira, N.1
Dupont, L.2
Tarascon, J.M.3
Klein, L.C.4
Amatucci, G.G.5
-
10
-
-
80053329500
-
Copper nitride nanocubes: Size-controlled synthesis and application as cathode catalyst in alkaline fuel cells
-
Wu, H. & Chen, W. Copper nitride nanocubes: size-controlled synthesis and application as cathode catalyst in alkaline fuel cells. J. Amer. Chem. Soc. 133, 15236-15239 (2011).
-
(2011)
J. Amer. Chem. Soc.
, vol.133
, pp. 15236-15239
-
-
Wu, H.1
Chen, W.2
-
11
-
-
79955981344
-
Growth and properties of Cu3N films and Cu3N/c-Fe4N bilayers
-
Borsa, D. M., Grachev, S., Presura, C. & Boerma, D. O. Growth and properties of Cu3N films and Cu3N/c-Fe4N bilayers. Appl. Phys. Lett. 80, 1823-1825 (2002).
-
(2002)
Appl. Phys. Lett.
, vol.80
, pp. 1823-1825
-
-
Borsa, D.M.1
Grachev, S.2
Presura, C.3
Boerma, D.O.4
-
12
-
-
84867498603
-
Resistive-switching behavior and mechanism in copper-nitride thin films prepared by DC magnetron sputtering
-
Zhu,W. et al. Resistive-switching behavior and mechanism in copper-nitride thin films prepared by DC magnetron sputtering. Phys. Status Solidi A 209, 1996-2001 (2012).
-
(2012)
Phys. Status Solidi A
, vol.209
, pp. 1996-2001
-
-
Zhu, W.1
-
13
-
-
33847264378
-
First-principles calculations of structural and electronic properties of Cu3MN compounds with M 5 Ni, Cu, Zn, Pd, Ag, and Cd
-
Moreno-Armenta, M. G., Perez, W. L.&Takeuchi, N. First-principles calculations of structural and electronic properties of Cu3MN compounds with M 5 Ni, Cu, Zn, Pd, Ag, and Cd. Solid State Sci. 9, 166-172 (2007).
-
(2007)
Solid State Sci.
, vol.9
, pp. 166-172
-
-
Moreno-Armenta, M.G.1
Perez, W.L.2
Takeuchi, N.3
-
14
-
-
0842264789
-
Ab initio total energy calculations of copper nitride: The effect of lattice parameters and Cu content in the electronic properties
-
Moreno-Armenta, M. G.,Mart?́nez-Ruiz, A. & Takeuchi, N. Ab initio total energy calculations of copper nitride: the effect of lattice parameters and Cu content in the electronic properties. Solid State Sci. 6, 9-14 (2004).
-
(2004)
Solid State Sci.
, vol.6
, pp. 9-14
-
-
Moreno-Armenta, M.G.1
Martacute2
Nez-Ruiz, A.3
Takeuchi, N.4
-
15
-
-
0038479475
-
Electronic structure and chemical-bonding mechanism of Cu3N Cu3NPd, and Related Cu(I) Compounds
-
Hahn, U. & Weber, W. Electronic structure and chemical-bonding mechanism of Cu3N, Cu3NPd, and related Cu(I) compounds. Phys. Rev. B 53, 12684-12693 (1996).
-
(1996)
Phys. Rev. B
, vol.53
, pp. 12684-12693
-
-
Hahn, U.1
Weber, W.2
-
16
-
-
38749116204
-
Addition of silver in copper nitride thin films deposited by reactive magnetron sputtering
-
Pierson, J. F.&Horwat, D. Addition of silver in copper nitride thin films deposited by reactive magnetron sputtering. Scripta Mater. 58, 568-570 (2008).
-
(2008)
Scripta Mater.
, vol.58
, pp. 568-570
-
-
Pierson, J.F.1
Horwat, D.2
-
17
-
-
79953238533
-
Insertion of Zn atoms into Cu3Nlattice: Structure distortion and modification of electronic properties
-
Gao, L., Ji, A. L., Zhang, W. B.&Cao, Z. X. Insertion of Zn atoms into Cu3Nlattice: structure distortion and modification of electronic properties. J. Cryst. Growth 321, 157-161 (2011).
-
(2011)
J. Cryst. Growth
, vol.321
, pp. 157-161
-
-
Gao, L.1
Ji, A.L.2
Zhang, W.B.3
Cao, Z.X.4
-
18
-
-
78650122301
-
Crystalline thin films of stoichiometic Cu3N and intercalated Cu3NMx (M 5 metals): Growth and physical properties
-
Ji, A. L., Gao, L., Du, Y. & Cao, Z. X. Crystalline thin films of stoichiometic Cu3N and intercalated Cu3NMx (M 5 metals): growth and physical properties. Phys. Status Solidi A 207, 2769-2780 (2010).
-
(2010)
Phys. Status Solidi A
, vol.207
, pp. 2769-2780
-
-
Ji, A.L.1
Gao, L.2
Du, Y.3
Cao, Z.X.4
-
19
-
-
33748460075
-
3N thin films by reactive magnetron sputtering
-
DOI 10.1016/j.jcrysgro.2006.07.007, PII S0022024806006944
-
Ji, A. L., Huang, R., Du, Y., Li, C. R. & Cao, Z. X. Growth of stoichiometric Cu3N thin films by reactive magnetron sputtering. J. Cryst. Growth 295, 79-83 (2006). (Pubitemid 44353494)
-
(2006)
Journal of Crystal Growth
, vol.295
, Issue.1
, pp. 79-83
-
-
Ji, A.L.1
Huang, R.2
Du, Y.3
Li, C.R.4
Wang, Y.Q.5
Cao, Z.X.6
-
20
-
-
20444376520
-
Electrical conductivity and photoreflectance of nanocrystalline copper nitride thin films deposited at low temperature
-
DOI 10.1016/j.jcrysgro.2005.03.077, PII S0022024805004264
-
Du, Y., Ji, A. L., Ma, L. B., Wang, Y. Q. & Cao, Z. X. Electical conductivity and photoreflectance of substoichiometric copper nitride thin films deposited at low temperature. J. Cryst. Growth 280, 490-494 (2005). (Pubitemid 40794410)
-
(2005)
Journal of Crystal Growth
, vol.280
, Issue.3-4
, pp. 490-494
-
-
Du, Y.1
Ji, A.L.2
Ma, L.B.3
Wang, Y.Q.4
Cao, Z.X.5
|