Cross-sectional specimen preparation from ICs downside for SEM and TEM-failure analyses using focused ion beam etching

Thin Solid Films

Volumn 343-344, Issue 1-2, 1999, Pages 609-611

  Altmann, F ^a   Katzer, D ^a  

^a Fraunhofer Inst F W   (Germany)

Author keywords

Cross sectional preparation; IC structures; Ion beam etching

Indexed keywords

ELECTRONICS PACKAGING; ETCHING; INTEGRATED CIRCUIT MANUFACTURE; ION BEAMS; MILLING (MACHINING); OPTICAL MICROSCOPY; SCANNING ELECTRON MICROSCOPY; SEMICONDUCTING SILICON; TRANSISTORS; TRANSMISSION ELECTRON MICROSCOPY; TRANSPARENCY;

FOCUSED ION BEAMS (FIB); ION MILLING;

FLIP CHIP DEVICES;

EID: 0032648685     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0040-6090(98)01683-6     Document Type: Article

References (5)

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