Microhardness of PEEK/ceramic micro- and nanocomposites: Correlation with Halpin-Tsai model

Materials Science and Engineering: A

Volumn 491, Issue 1-2, 2008, Pages 230-236

  Goyal, R K ^a   Tiwari, A N ^b   Negi, Y S ^c  

^a CENTRE FOR MATERIALS FOR ELECTRONICS TECHNOLOGY C MET   (India)

^b INDIAN INSTITUTE OF TECHNOLOGY BOMBAY   (India)

^c INDIAN INSTITUTE OF TECHNOLOGY ROORKEE   (India)

Author keywords

Hardness; Particle reinforced composites; Polymer matrix composites; Scanning electron microscopy

Indexed keywords

ALUMINA; ALUMINUM NITRIDE; ALUMINUM OXIDE; CERAMIC MATERIALS; CERAMIC MATRIX COMPOSITES; METALLIC MATRIX COMPOSITES; MICROHARDNESS; NANOCOMPOSITES; PARTICLE REINFORCED COMPOSITES; POLYMER MATRIX COMPOSITES; VICKERS HARDNESS;

CERAMIC NANOCOMPOSITES; CERAMICS PARTICLES; HALPIN-TSAI MODEL; MATRIX COMPOSITE; MICRO- AND NANOCOMPOSITES; MICROCOMPOSITE; NANO-SIZE; PARTICLE-REINFORCED COMPOSITES; PERFORMANCE; VICKER HARDNESS;

SCANNING ELECTRON MICROSCOPY;

EID: 46249094676     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2008.01.091     Document Type: Article

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