Size effect on the intermetallic compound coalescence in Sn-Ag-Cu solder and Sn-Ag-Cu/Cu solder joints

ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging

Volumn , Issue , 2011, Pages 248-253

  Min Bo, Zhou ^a   Xiao, Ma ^a   Xin Ping, Zhang ^a,b  

^a SOUTH CHINA UNIVERSITY OF TECHNOLOGY   (China)

^b HARBIN INSTITUTE OF TECHNOLOGY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

CU ATOMS; CU CONTENT; EDS ANALYSIS; MICRO-SCALES; REFLOW--SOLDERING; SIZE EFFECTS; SN-AG-CU; SNAGCU SOLDER; SOLDER BALLS; SOLDER INTERCONNECTS; SOLDER JOINTS; SOLDER MATRIX; SOLIDIFICATION PROCESS;

COALESCENCE; DIFFERENTIAL SCANNING CALORIMETRY; ELECTRONICS PACKAGING; FLIP CHIP DEVICES; INTERMETALLICS; PACKAGING; SILVER; SOLDERING; SOLDERING ALLOYS; SOLIDIFICATION; SPHERES; UNDERCOOLING;

TIN;

EID: 81355132127     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2011.6066830     Document Type: Conference Paper

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