Development and characterization of a through-multilayer TSV integrated SRAM module

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2013, Pages 885-890

  Zhu, Yunhui ^a   Ma, Shenglin ^a,b   Sun, Xin ^a   Fang, Runiu ^a   Zhong, Xiao ^a   Bian, Yuan ^a   Chen, Meng ^a   Chen, Jing ^a   Miao, Min ^a,c   Lu, Wengao ^a   Jin, Yufeng ^a  

^a PEKING UNIVERSITY   (China)

^b XIAMEN UNIVERSITY   (China)

^c BEIJING INFORMATION SCIENCE AND TECHNOLOGY UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ADDRESS BUS; CMP PROCESS; COATING TECHNOLOGIES; DOUBLE LAYERS; INTEGRATION PROCESS; LIFT-OFF PROCESS; MEMORY CHIPS; VIA FILLING;

INTEGRATION; PHOTORESISTS; STATIC RANDOM ACCESS STORAGE;

MULTILAYERS;

EID: 84883395839     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2013.6575678     Document Type: Conference Paper

References (10)

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