Process development of multi-layer stacked chip module

ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging

Volumn , Issue , 2011, Pages 118-120

  Ma, Shenglin ^a   Sun, Xin ^a   Zhu, Yunhui ^a   Kang, Wenping ^a   Cui, Qinghu ^a   Miao, Min ^a,b   Chen, Jin ^a   Jin, Yufeng ^a  

^a PEKING UNIVERSITY   (China)

^b BEIJING INFORMATION SCIENCE AND TECHNOLOGY UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING PROCESS; MICRO-BUMPS; MULTIPLE LAYERS; PROCESS DEVELOPMENT;

PACKAGING; TIN;

CHIP SCALE PACKAGES;

EID: 81355142665     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2011.6066802     Document Type: Conference Paper

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