Process simulation of DRIE and its application in tapered TSV fabrication

Proceedings, 2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008

Volumn , Issue , 2008, Pages

  Miao, Min ^a,b   Liao, Hongguang ^a   Wan, Xin ^a   Zhao, Liwei ^a   Guo, Yunxia ^a   Jin, Yufeng ^a  

^a PEKING UNIVERSITY   (China)

^b BEIJING INFORMATION SCIENCE AND TECHNOLOGY UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; COPPER PLATING; ELECTRONICS PACKAGING; ELECTROPLATING; EVOLUTIONARY ALGORITHMS; NONMETALS; OPTICAL DESIGN; SILICON; THREE DIMENSIONAL;

DRILLING METHODS; ELECTRONIC PACKAGING; EVOLUTION ALGORITHMS; EXPERIMENTAL METHODOLOGY; HIGH-DENSITY; HIGH-DENSITY PACKAGING; INTERNATIONAL CONFERENCES; MICRO-FABRICATION; PROCESS CONDITIONS; PROCESS SIMULATIONS; SECTIONAL PROFILES; SIMULATED RESULTS; THREE-DIMENSIONAL INTEGRATION; THROUGH SILICON VIA;

TECHNOLOGY;

EID: 52449108075     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2008.4606984     Document Type: Conference Paper

References (6)

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5. Ochi S.; Echigo F., "A study of Advanced ALIVH interconnection Technology". 8 th IEEE international symposium on advanced packaging materials, 2002, pp. 356-361.
6. Puech M., Thevenoud JM, Gruffat JM., Launay N., et al, "Cost Effective DRIE for Mass Production of MEMS and 3D Interconnections", Equipment for Electronic Products Manufacturing, Vol. 144, No.6, (2006), pp.37-44.