Investigation of the interfacial adhesion of the transparent conductive oxide films to large-area flexible polymer substrates using laser-induced thermo-mechanical stresses

Journal of Applied Physics

Volumn 114, Issue 6, 2013, Pages

  Park, Jin Woo ^a   Lee, Seung Ho ^a   Yang, Chan Woo ^a  

^a Yonsei University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

FLEXIBLE POLYMER SUBSTRATES; INTERFACE MI-CROSTRUCTURE; INTERFACIAL ADHESION STRENGTH; INTERFACIAL DELAMINATION; THEORETICAL CALCULATIONS; THERMO-MECHANICAL STRESS; TRANSPARENT CONDUCTIVE OXIDE FILMS; TRANSPARENT CONDUCTIVE OXIDES;

ADHESION; BUCKLING; COMPRESSIVE STRESS; ELASTIC MODULI; GRAIN BOUNDARIES; ISOMERS; NEODYMIUM LASERS; OXIDE FILMS; POLYMERS; THERMAL EXPANSION;

SUBSTRATES;

EID: 84883393992     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.4818310     Document Type: Article

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