Thermal stability of twins and strengthening mechanisms in differently oriented epitaxial nanotwinned Ag films

Journal of Materials Research

Volumn 28, Issue 13, 2013, Pages 1729-1739

  Bufford, Daniel ^a   Wang, Haiyan ^a   Zhang, Xinghang ^a  

^a Department of Electrical and Computer Engineering   (United States)

Author keywords

Keywords annealing; nanoscale; strength

Indexed keywords

ELEVATED TEMPERATURE; GROWTH DIRECTIONS; HOMOLOGOUS TEMPERATURE; NANO SCALE; STRENGTH; STRENGTHENING MECHANISMS; STRENGTHENING MODEL; TWIN-BOUNDARY ORIENTATION;

ANNEALING; EPITAXIAL FILMS; EPITAXIAL GROWTH; GRAIN BOUNDARIES; HARDNESS;

SILVER;

EID: 84880214493     PISSN: 08842914     EISSN: 20445326     Source Type: Journal    
DOI: 10.1557/jmr.2013.50     Document Type: Article

References (59)

1. L. Lu, Y.F. Shen, M. Dao, and S. Suresh: Strain rate sensitivity of Cu with nanoscale twins. Scr. Mater. 55(4), 319 (2006).
2. S. Suresh, M. Dao, L. Lu, and Y.F. Shen: Strength, strain-rate sensitivity and ductility of copper with nanoscale twins. Acta Mater. 54(20), 5421 (2006).
3. S. Suresh, L. Lu, R. Schwaiger, Z.W. Shan, M. Dao, and K. Lu: Nano-sized twins induce high rate sensitivity of flow stress in pure copper. Acta Mater. 53(7), 2169 (2005).
4. J.R. Weertman, C.J. Shute, B.D. Myers, S. Xie, T.W. Barbee, and A.M. Hodge: Microstructural stability during cyclic loading of multilayer copper/copper samples with nanoscale twinning. Scr. Mater. 60(12), 1073 (2009).
5. J.R.Weertman, C.J. Shute,B.D.Myers, S. Xie, S.Y. Li, T.W.Barbee, and A.M. Hodge: Detwinning, damage and crack initiation during cyclic loading of Cu samples containing aligned nanotwins. Acta Mater. 59(11), 4569 (2011).
6. O. Anderoglu, A. Misra, H. Wang, F. Ronning, M.F. Hundley, and X. Zhang: Epitaxial nanotwinned Cu films with high strength and high conductivity. Appl. Phys. Lett. 93(8), 083108-083108-3 (2008).
7. L. Lu, X. Chen, X. Huang, and K. Lu: Revealin. The maximum strength in nanotwinned copper. Science 323(5914), 607 (2009).
8. O. Anderoglu, A. Misra, F. Ronning, H. Wang, and X. Zhang: Significant enhancement o. The strength-to-resistivity ratio by nanotwins in epitaxial Cu films. J. Appl. Phys. 106(2), 024313-024313-9 (2009).
9. X. Zhang, A. Misra, H. Wang, J.G. Swadener, A.L. Lima, M.F. Hundley, and R.G. Hoagland: Thermal stability of sputterdeposited 330 austenitic stainless-steel thin films with nanoscale growth twins. Appl. Phys. Lett. 87(23), 233116-233116-3 (2005).
10. K. Lu, L. Lu, and S. Suresh: Strengthening materials by engineering coherent internal boundaries a. The nanoscale. Science 324(5925), 349 (2009).
11. L. Lu, Y.F. Shen, X.H. Chen, L.H. Qian, and K. Lu: Ultrahigh strength and high electrical conductivity in copper. Science 304(5669), 422 (2004).
12. D. Bufford, X. Zhang, and H. Wang: High strength, epitaxial nanotwinned Ag films. Acta Mater. 59(1), 93 (2011).
13. X. Zhang, A.Misra, H.Wang, M.Nastasi, J.D. Embury, T.E. Mitchell, R.G. Hoagland, and J.P. Hirth: Nanoscale-twinning-induced strengthening in austenitic stainless steel thin films. Appl. Phys. Lett. 84(7), 1096 (2004).
14. X. Zhang, A.Misra, H. Wang, T.D. Shen, M. Nastasi, T.E. Mitchell, J.P. Hirth, R.G. Hoagland, and J.D. Embury: Enhanced hardening in Cu/330 stainless steel multilayers by nanoscale twinning. Acta Mater. 52(4), 995 (2004).
15. P. Gu, M. Dao, R.J. Asaro, and S. Suresh: A unified mechanistic model for size-dependent deformation in nanocrystalline and nanotwinned metals. Acta Mater. 59(18), 6861 (2011).
16. C.C. Koch, D.G. Morris, K. Lu, and A. Inoue: Ductility of nanostructured materials. MRS Bull. 24(2), 54 (1999).
17. O. Anderoglu, A. Misra, J. Wang, R.G. Hoagland, J.P. Hirth, and X. Zhang: Plastic flow stability of nanotwinned Cu foils. Int. J. Plast. 26(6), 875 (2010).
18. N. Li, J. Wang, J.Y. Huang, A. Misra, and X. Zhang: Influence of slip transmission o. The migration of incoherent twin boundaries in epitaxial nanotwinned Cu. Scr. Mater. 64(2), 149 (2011).
19. N. Li, J. Wang, A. Misra, X. Zhang, J.Y. Huang, and J.P. Hirth: Twinning dislocation multiplication at a coherent twin boundary. Acta Mater. 59(15), 5989 (2011).
20. T. Chookajorn, H.A. Murdoch, and C.A. Schuh: Design of stable nanocrystalline alloys. Science 337(6097), 951 (2012).
21. L.E. Murr: Interfacial Phenomena in Metals and Alloys (Addison- Wesley Pub. Co., Adv. Book Program, London, 1975).
22. J.P. Hirth and J. Lothe: Theory of Dislocations (Wiley, New York, 1982).
23. O. Anderoglu, A. Misra, H. Wang, and X. Zhang: Thermal stability of sputtered Cu films with nanoscale growth twins. J. Appl. Phys. 103(9), 094322-094322-6 (2008).
24. X. Zhang and A. Misra: Superior thermal stability of coherent twin boundaries in nanotwinned metals. Scr. Mater. 66(11), 860 (2012).
25. J. Wang, O. Anderoglu, J.P. Hirth, A. Misra, and X. Zhang: Dislocation structures of Sigma 3 {112} twin boundaries in face centered cubic metals. Appl. Phys. Lett. 95(2), 021908-021908-3 (2009).
26. D.L. Medlin, G.H. Campbell, and C.B. Carter: Stacking defects i. The 9R phase at an incoherent twin boundary in copper. Acta Mater. 46(14), 5135 (1998).
27. J. Wang, N. Li, O. Anderoglu, X. Zhang, A. Misra, J.Y. Huang, and J.P. Hirth:Detwinning mechanisms for growth twins in face-centered cubic metals. Acta Mater. 58(6), 2262 (2010).
28. L. Liu, J. Wang, S.K. Gong, and S.X. Mao: High resolution transmission electron microscope observation of zero-strain deformation twinning mechanisms in Ag. Phys. Rev. Lett. 106(17), 175504 (2011).
29. N. Li, J. Wang, X. Zhang, and A. Misra: In-situ TEM study of dislocation-twin boundaries interaction in nanotwinned Cu films. JOM 63(9), 62 (2011).
30. L. Xu, D. Xu, K.N. Tu, Y. Cai, N. Wang, P. Dixit, J.H.L. Pang, and J.M. Miao: Structure and migration of (112) step on (111) twin boundaries in nanocrystalline copper. J. Appl. Phys. 104(11), 113717-113717-5 (2008).
31. C.B. Carter, D.L. Medlin, J.E. Angelo, and M.J. Mills: The 112 lateral twin boundary in FCC materials. Mater. Sci. Forum 207-212 (1996).
32. T.C. Nason, G.R. Yang, K.H. Park, and T.M. Lu: Study of silver diffusion into Si(111) and Sio2 at moderate temperatures. J. Appl. Phys. 70(3), 1392 (1991)..
33. L. Weber: Equilibrium solid solubility of silicon in silver. Metall. Mater. Trans. A. 33(4), 1145 (2002).
34. P.Y. Chevalier: Thermodynamic evaluation o. The Ag-Si system. Thermochim. Acta 130, 33 (1988).
35. S.J. Rothman, N.L. Peterson, and J.T. Robinson: Isotope effect for self-diffusion in single crystals of silver. Phys. Status Solidi. 39(2), 635 (1970).
36. J. Bihr, H. Mehrer, and K. Maier: Comparison between microsectioning studies of lowerature self-diffusion in silver. Phys. Status Solidi A. 50(1), 171 (1978)..
37. P. Varotsos and K. Alexopoulos: Calculation of diffusioncoefficients at any temperature and pressure from a single measurement. Self-diffusion. Phys. Rev. B. 22(6), 3130 (1980).
38. D. Hull and D.J. Bacon: Introduction to Dislocations, 4th ed. (Butterworth Heinemann, Boston, 2001).
39. L.M. Clarebro, R.L. Segall, and M.H. Loretto: Faulted defects in quenched copper and silver. Philos. Mag. 13(126), 1285 (1966).
40. G.M. Pharr and W.C. Oliver: Nanoindentation of silver-relations between hardness and dislocation-structure. J. Mater. Res. 4(1), 94 (1989).
41. D. Christopher, R. Smith, and A. Richter: Atomistic modelling of nanoindentation in iron and silver. Nanotechnology 12(3), 372 (2001).
42. D.C. Jang, X.Y. Li, H.J. Gao, and J.R. Greer: Deformation mechanisms in nanotwinned metal nanopillars. Nat. Nanotechnol. 7(9), 594 (2012).
43. B.N. Singh, A.J.E. Foreman, and H. Trinkaus: Radiation hardening revisited: Role of intracascade clustering. J. Nucl. Mater. 249(2-3), 103 (1997).
44. D.B. Williams and C.B. Carter: Transmission Electron Microscopy: A Textbook for Materials Science (Plenum, New York, 1996), pp. 321-322.
45. G.I. Taylor: The mechanismof plastic deformation of crystals. Part I. Theoretical. Proc. R. Soc. London, Ser. A. 145(855), 362 (1934).
46. M.L. Grossbeck, P.J. Maziasz, and A.F. Rowcliffe: Modeling of strengtheningmechanisms in irradiated fusion-reactor 1st wall alloys. J. Nucl. Mater. 191, 808 (1992).
47. M. Mata, M. Anglada, and J. Alcala: Contact deformation regimes around sharp indentations an. The concept o. The characteristic strain. J. Mater. Res. 17(5), 964 (2002).
48. D. Tabor: The Hardness of Metals (Oxford University Press, Oxford, UK, 2000), pp. 105.
49. M.H. Zhao, W.S. Slaughter, M. Li, and S.X. Mao: Material-lengthscale- controlled nanoindentation size effects due to strain-gradient plasticity. Acta Mater. 51(15), 4461 (2003).
50. A.V. Panin, A.R. Shugurov, and K.V. Oskomov: Mechanical properties of thin Ag films on a silicon substrate studied usin. The nanoindentation technique. Phys. Solid State 47(11), 2055 (2005).
51. Y.F. Cao, S. Allameh, D. Nankivil, S. Sethiaraj, T. Otiti, and W. Soboyejo: Nanoindentation measurements o. The mechanical properties of polycrystalline Au and Ag thin films on silicon substrates: Effects of grain size and film thickness. Mater. Sci. Eng., A 427(1-2), 232 (2006).
52. Y.Q. Fu, C. Shearwood, B. Xu, L.G. Yu, and K.A. Khor: Characterization of spark plasma sintered Ag nanopowders. Nanotechnology. 21(11), 115707 (2010)..
53. R.J. Asaro and S. Suresh: Mechanistic models fo. The activation volume and rate sensitivity in metals with nanocrystalline grains and nano-scale twins. Acta Mater. 53(12), 3369 (2005).
54. P. Gu, B.K. Kad, and M. Dao: A modified model for deformation via partial dislocations and stacking faults a. The nanoscale. Scr. Mater. 62(6), 361 (2010).
55. J.L. McCall: Practical applications of quantitative metallography: A symposium (American Society for Testing and Materials, Ann Arbor, MI, 1984).
56. M.D. Merz and S.D. Dahlgren: Tensile-strength and work-hardening of ultrafine-grained high-purity copper. J. Appl. Phys. 46(8), 3235 (1975).
57. A. Misra, J.P. Hirth, and R.G. Hoagland: Length-scale-dependent deformation mechanisms in incoherent metallic multilayered composites. Acta Mater. 53(18), 4817 (2005).
58. X. Zhang, A. Misra, H. Wang, A.L. Lima, M.F. Hundley, and R.G. Hoagland: Effects of deposition parameters on residual stresses, hardness and electrical resistivity of nanoscale twinned 330 stainless steel thin films. J. Appl. Phys. 97(094302), 5 (2005).
59. B. Zhu, R.J. Asaro, P. Krysl, and R. Bailey: Transition of deformation mechanisms and its connection to grain size distribution in nanocrystalline metals. Acta Mater. 53(18), 4825 (2005)