Strain rate sensitivity of Cu with nanoscale twins

Scripta Materialia

Volumn 55, Issue 4, 2006, Pages 319-322

  Shen, Y F ^a   Lu, L ^a,b   Dao, M ^b   Suresh, S ^b  

^a INSTITUTE OF METAL RESEARCH   (China)

^b Massachusetts Institute of Technology Cambridge   (United States)

Author keywords

Copper; Nanocrystalline materials; Nanoscale twins; Pulsed electrodeposition; Strain rate sensitivity

Indexed keywords

COPPER; CRYSTALLINE MATERIALS; DEFORMATION; ELECTRODEPOSITION; NANOSTRUCTURED MATERIALS; TENSILE STRESS; TRANSMISSION ELECTRON MICROSCOPY;

NANOSCALE TWINS; POST-DEFORMATION TRANSMISSION ELECTRON MICROSCOPY; PULSED ELECTRODEPOSITION; STRAIN RATE SENSITIVITY;

STRAIN RATE;

EID: 33744819706     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.scriptamat.2006.04.046     Document Type: Article

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