Electrical contact at the interface between silicon and transfer-printed gold films by eutectic joining

ACS Applied Materials and Interfaces

Volumn 5, Issue 13, 2013, Pages 6061-6065

  Keum, Hohyun ^a   Chung, Hyun Joong ^b   Kim, Seok ^a  

^a UNIVERSITY OF ILLINOIS AT URBANA CHAMPAIGN   (United States)

^b UNIVERSITY OF ALBERTA   (Canada)

Author keywords

contact resistance; eutectic bonding; metal semiconductor contact; transfer printing; transmission line model

Indexed keywords

ELECTRICAL CONTACTS; EUTECTIC BONDING; MECHANICAL BONDING; METAL-SEMICONDUCTOR CONTACTS; MICRO-MANUFACTURING; MORPHOLOGICAL PROPERTIES; TRANSFER PRINTING; TRANSMISSION LINE MODELS;

CONTACT RESISTANCE; ELECTRIC CONTACTS; ELECTRIC PROPERTIES; EUTECTICS; GOLD; JOINING; PRINTING; SEMICONDUCTING SILICON; SILICON; TRANSMISSION LINE THEORY;

INTERFACES (MATERIALS);

EID: 84880066997     PISSN: 19448244     EISSN: 19448252     Source Type: Journal    
DOI: 10.1021/am4021236     Document Type: Article

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