Origin of local temperature variation during spike anneal and millisecond anneal

16th IEEE International Conference on Advanced Thermal Processing of Semiconductors, RTP 2008

Volumn , Issue , 2008, Pages 183-193

  Beneyton, R ^a   Colin, A ^a   Bono, H ^a   Cacho, F ^a   Bidaud, M ^a   Dumont, B ^a   Morin, P ^a   Barla, K ^a  

^a STMICROELECTRONICS   (France)

Author keywords

[No Author keywords available]

Indexed keywords

DIFFRACTION EFFECTS; FINITE ELEMENT METHODOLOGY; LOCAL TEMPERATURE; PATTERN EFFECT; PATTERNED STRUCTURE; STACKED LAYER; TEMPERATURE VARIATION; THERMAL VARIATION;

EXPERIMENTS; RAPID THERMAL ANNEALING; RAPID THERMAL PROCESSING; SILICON WAFERS; TEMPERATURE DISTRIBUTION;

THERMAL CONDUCTIVITY;

EID: 84879864756     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/RTP.2008.4690554     Document Type: Conference Paper

References (12)

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