Surface-tension-driven self-alignment of microchips on black-silicon-based hybrid template in ambient air

Journal of Microelectromechanical Systems

Volumn 22, Issue 3, 2013, Pages 739-746

  Shah, Ali ^a   Chang, Bo ^a   Suihkonen, Sami ^a   Zhou, Quan ^a   Lipsanen, Harri ^a  

^a AALTO UNIVERSITY   (Finland)

Author keywords

Black silicon; fluoropolymer; hybrid template; self alignment; self assembly; solid edge; wetting contrast

Indexed keywords

BLACK SILICON; FLUOROPOLYMER; HYBRID TEMPLATE; SELF ALIGNMENT; SOLID EDGE;

ALIGNMENT; FLUORINE CONTAINING POLYMERS; PHOTOLITHOGRAPHY; SELF ASSEMBLY; SILICA; WETTING;

MICROPROCESSOR CHIPS;

EID: 84878535379     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/JMEMS.2013.2243109     Document Type: Article

References (37)

1. H. Yeh and J. S. Smith, "Fluidic self-assembly for the integration of GaAs light-emitting diodes on Si substrates, " IEEE Photon. Technol. Lett. , vol. 6, no. 6, pp. 706-708, Jun. 1994.
2. C. G. Fonstad and M. Zahn, "Method and system for magnetically assisted statistical assembly of wafers, " U. S. Patent 7 956 382, Jun. 7, 2011.
3. H. Ota, T. Araki, M. Takeda, H. Narumiya, and T. Ohara, "Assembling process for microscopic components using magnetic force, " in Proc. IEEE Micro Elect. Mech. Syst. , 1997, pp. 209-214.
4. K.-F. Bohringer, K. Goldberg, M. Cohn, R. Howe, and A. Pisano, "Parallel microassembly with electrostatic force fields, " in Proc. IEEE Int. Conf. Robot. Autom. , 1998, vol. 2, pp. 1204-1211.
5. U. Srinivasan, D. Liepmann, and R. T. Howe, "Microstructure to substrate self-assembly using capillary forces, " J. Microelectromech. Syst. , vol. 10, no. 1, pp. 17-24, Mar. 2001. (Pubitemid 32287836)
6. J. Fang and K.-F. Bohringer, "Parallel micro component-to-substrate assembly with controlled poses and high surface coverage, " J. Micromech. Microeng. , vol. 16, no. 4, pp. 721-730, Apr. 2006.
7. V. Sariola, M. Jääskeläinen, and Q. Zhou, "Hybrid microassembly combining robotics and water droplet self-alignment, " IEEE Trans. Robot. , vol. 26, no. 6, pp. 965-977, Dec. 2010.
8. K. Sato, K. Ito, S. Hata, and A. Shimokohbe, "Self-alignment of microparts using liquid surface tension-behavior of micropart and alignment characteristics, " Precis. Eng. , vol. 27, no. 1, pp. 42-50, Jan. 2003.
9. T. Fukushima, E. Iwata, Y. Ohara, M. Murugesan, B. Jichoel, L. Kangwook, T. Tanaka, and M. Koyanagi, "Multichip self-assembly technology for advanced die-to-wafer 3-D integration to precisely align known good dies in batch processing, " IEEE Trans. Compon. Packag. Manuf. Technol. , vol. 1, no. 12, pp. 1873-1884, Dec. 2011.
10. C. G. Tsai, C. M. Hsieh, and J. A. Yeh, "Self-alignment of microchips using surface tension and solid edge, " Sens. Actuators A, Phys. , vol. 139, no. 1/2, pp. 343-349, Sep. 2007. (Pubitemid 47314216)
11. C. Del-Corral, Q. Zhou, A. Albut, B. Chang, S. Franssila, S. Tuomikoski, and H. N. Koivo, "Droplet based self-assembly of SU-8 microparts, " in Proc. 2nd DVE World MICRO Technol. Congr. , Berlin, Germany, 2003, pp. 293-298.
12. J. Fang and K.-F. Bohringer, "High yield batch packaging of microdevices with uniquely oriented self-assembly, " in Proc. IEEE Micro Elect. Mech. Syst. , 2005, pp. 12-15. (Pubitemid 41462286)
13. B. Chang, I. Routa, V. Sariola, and Q. Zhou, "Self-alignment of RFID dies on four-pad patterns with water droplet for sparse self-assembly, " J. Micromech. Microeng. , vol. 21, no. 9, p. 095024, Sep. 2011.
14. Alien technology, Morgan Hill, CA, USA. [Online]. Available: http://www.alientechnology.com/fsa-manufacturing. php
15. B. Chang, V. Sariola, S. Aura, R. H. A. Ras, M. Klonner, H. Lipsanen, and Q. Zhou, "Capillary-driven self-assembly of microchips on oleophilic/oleophobic patterned surface using adhesive droplet in ambient air, " Appl. Phys. Lett. , vol. 99, no. 3, pp. 034104-1-034104-3, Jul. 2011.
16. K. Sato, K. Lee, M. Nishimura, and K. Okutsu, "Self-alignment and bonding of microparts using adhesive droplets, " Int. J. Precis. Eng. Manuf. , vol. 8, no. 2, pp. 75-79, Apr. 2007.
17. J. Tien, T. L. Breen, and G. M. Whitesides, "Crystallization of millimeterscale objects with use of capillary forces, " J. Amer. Chem. Soc. , vol. 120, no. 48, pp. 12 670-12 671, Dec. 1998. (Pubitemid 29003628)
18. R. S. Fearing, "Survey of sticking effects of micro parts handling, " in Proc. IEEE/RSJ Int. Workshop Intell. Robot. Syst. , 1995, vol. 2, pp. 212-217.
19. M. Mastrangeli, W. Ruythooren, C. Van-Hoof, and J.-P. Celis, "Conformal dip-coating of patterned surfaces for capillary die-to-substrate self-assembly, " J. Micromech. Microeng. , vol. 19, no. 4, p. 045015, Apr. 2009.
20. B. Chang, V. Sariola, M. Jääskeläinen, and Q. Zhou, "Self-alignment in the stacking of microchips with mist-induced water droplets, " J. Micromech. Microeng. , vol. 21, no. 1, p. 015016, Jan. 2011.
21. U. Srinivasan, R. T. Howe, and D. Liepmann, "Fluidic microassembly using patterned self-assembled monolayers and shape matching, " in Proc. Int. Conf. on Solid-State Sensors and Actuators, Sendai, Japan, Jun. 7-10, 1999, pp. 1170-1173.
22. A. Terfort, N. Bowden, and G. M. Whitesides, "Three-dimensional selfassembly of millimetre-scale components, " Nature, vol. 386, no. 6621, pp. 162-164, Mar. 1997.
23. J. F. Oliver, C. Huh, and S. G. Mason, "Resistance to spreading of liquids by sharp edges, " J. Coll. Interf. Sci. , vol. 59, no. 3, pp. 568-581, May 1977.
24. B. R. Martin, D. C. Furnange, T. N. Jackson, T. E. Mallouk, and T. S. Mayer, "Self-alignment of patterned wafers using capillary forces at water-air interface, " Adv. Funct. Mater. , vol. 11, no. 5, pp. 381-386, Oct. 2001. (Pubitemid 33046428)
25. H. O. Jacobs, A. R. Tao, A. Schwartz, D. H. Gracias, and G. M. Whitesides, "Fabrication of a cylindrical display by patterned assembly, " Science, vol. 296, no. 5566, pp. 323-325, Apr. 2002. (Pubitemid 34303681)
26. C. J. Morris and B. A. Parviz, "Micro-scale metal contacts for capillary force-driven self-assembly, " J. Micromech. Microeng. , vol. 18, no. 1, p. 015022, Jan. 2008.
27. X.-M. Li, D. Reinhoudt, and M. Crego-Calama, "What do we need for superhydrophobic surface? A review on the recent progress in the preparation of superhydrophobic surfaces, " Chem. Soc. Rev. , vol. 36, no. 8, pp. 1350-1368, Aug. 2007.
28. L. Sainiemi, V. Jokinen, A. Shah, M. Shpak, S. Aura, P. Suvanto, and S. Franssila, "Non-reflecting silicon and polymer surfaces by plasma etching and replication, " Adv. Mater. , vol. 23, no. 1, pp. 122-126, Jan. 2011.
29. V. Jokinen, L. Sainiemi, and S. Franssila, "Complex droplets on chemically modified silicon nanograss, " Adv. Mater. , vol. 20, no. 18, pp. 3453-3456, Sep. 2008.
30. C. Dorrer and J. Rühe, "Wetting of silicon nanograss: From superhydrophobic to superhydrophilic surfaces, " Adv. Mater. , vol. 20, no. 1, pp. 159-163, Jan. 2008. (Pubitemid 351143312)
31. H. Jansen, M. De-Boer, R. Legtenberg, and M. Elwenspoek, "The black silicon method: A universal method for determining the parameter setting of a fluorine based reactive ion etcher in deep silicon trench etching with profile control, " J. Micromech. Microeng. , vol. 5, no. 2, pp. 115-120, Jun. 1995.
32. T. Nishino, M. Meguro, K. Nakamae, M. Matsushita, and Y. Ueda, "The lowest surface free energy based on-CF3 alignment, " Langmuir, vol. 15, no. 13, pp. 4321-4323, Jun. 1999.
33. T. Young, "An essay on the cohesion of fluids, " Philos. Trans. R. Soc. Lond. A, Math. Phys. Sci. , vol. 95, no. 1, pp. 65-87, Jan. 1805.
34. R. N. Wenzel, "Resistance of solid surfaces to wetting by water, " Ind. Eng. Chem. , vol. 28, no. 8, pp. 988-994, Aug. 1936.
35. A. B. D. Cassie and S. Baxter, "Wettability of porous surfaces, " Trans. Faraday Soc. , vol. 40, pp. 546-551, Jan. 1944.
36. J. W. Gibbs, Scientific Papers, vol. 1. London, U. K. : Longmans, 1906, p. 326, (Dover reprint, New York, 1961).
37. B. Chang, A. Shah, I. Routa, H. Lipsanen, and Q. Zhou, "Surfacetension driven self-assembly of microchips on hydrophobic receptor sites with water using forced wetting, " Appl. Phys. Lett. , vol. 101, no. 11, pp. 114105-1-114105-5, Sep. 2012.