A bump transfer method for flip chip assembly

Proceedings of 5th Electronics Packaging Technology Conference, EPTC 2003

Volumn , Issue , 2003, Pages 321-323

  Zhang, J ^a,b   Wang, C H ^a  

^a HERIOT WATT UNIVERSITY   (United Kingdom)

^b SHANGHAI UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; ELECTRONICS PACKAGING; FLIP CHIP DEVICES; GOLD; NICKEL;

ALUMINUM PAD; BONDING LAYERS; BUMP TRANSFER METHOD; ELECTROLESS NICKEL; FLIP CHIP ASSEMBLIES; POLYIMIDE SUBSTRATE; TEST CHIPS; THERMO COMPRESSION BONDING;

CHIP SCALE PACKAGES;

EID: 84878354956     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2003.1271538     Document Type: Conference Paper

References (5)

1. Zakel, E. et al, "A Roadmap to Low Cost Bumping for DCA, COF, CSP and BGA", Proc. the IEEE/CPMT International Electronics Manufacturing Technology Symposium, Berlin, November 1998, pp. 55-62.
2. Jordan, J. "Gold stud bump in flip chip applications", Proc. the SEMI/IEEE International Electronics Manufacturing Technology Symposium, 2002, pp. 110-114.
3. Wang, C. H. et al, "Laser assisted bumping for flip chip assembly", IEEE Transactions on Electronics Packaging Manufacturing, Vol. 24, No. 2 (2001), pp. 109-114.
4. Datta, M. et al, "Electroless Remetallization of Aluminium Bond Pads on CMOS Drive Chip For Flip-Chip Attachment to Vertical Cavity Surface Emitting Lasers (VCSEL'S)", IEEE Trans. on Components and Packaging Technology, Vol. 22, No. 2 (1996), pp. 299-306.
5. Qi, G. et al, "Zincating Morphology of Aluminium Bond Pad: Its Influence on Quality of Electroless Nickel Bumping", Thin Solid Films, Vol. 406, (2002), pp. 219-223.