Wafer bonding with intermediate parylene layer

International Conference on Solid-State and Integrated Circuits Technology Proceedings, ICSICT

Volumn , Issue , 2008, Pages 2428-2431

  Shu, Qiong ^a   Huang, Xianju ^a   Wang, Ying ^a   Chen, Jing ^a  

^a PEKING UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVE LAYERS; BONDING FORCES; BONDING QUALITIES; BONDING STRENGTHS; IN VACUUMS; JOINT AREAS; PARYLENE; PROCESS PARAMETERS;

DIFFUSION BONDING; INTEGRATED CIRCUITS; SEMICONDUCTING SILICON COMPOUNDS; SILICON WAFERS;

WAFER BONDING;

EID: 60649117796     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICSICT.2008.4735061     Document Type: Conference Paper

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