LTCC an enabling technology for RF-, microwave, bio- and chemical systems

IMAPS/ACerS - 2nd International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2006

Volumn , Issue , 2006, Pages 452-457

  Müller, Jens ^a   Perrone, Ruben ^a   Rentsch, Sven ^a   Thelemann, Torsten ^a   Hinz, Michael ^a   Schober, Andreas ^a   Friedrich, Thomas ^a   Schwanke, Dieter ^b   Haas, Thomas ^b   Rebenklau, Lars ^c  

^a ILMENAU UNIVERSITY OF TECHNOLOGY   (Germany)

^b MSE Micro Systems Engineering GmbH & Co   (Germany)

^c DRESDEN UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

Bio and chemical systems; LTCC; Microwave; RF

Indexed keywords

CHEMICAL SYSTEMS; HIGH-TEMPERATURE COFIRED CERAMICS; LOW-TEMPERATURE CO-FIRED CERAMICS; LTCC; RF; SELF-RESONANCE FREQUENCY; SIGNAL CARRIER FREQUENCY; THREE-DIMENSIONAL STRUCTURE;

BIOSENSORS; CERAMIC MATERIALS; EXHIBITIONS; MANUFACTURE; MICROSYSTEMS; MICROWAVE CIRCUITS; MICROWAVES; TECHNOLOGY; THERMAL CONDUCTIVITY; THICK FILMS; THREE DIMENSIONAL;

STRUCTURAL DESIGN;

EID: 84878217160     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (13)

1. J. Müller, J. Klein, J. Rayho: In-process verification of MLC substrates, Microelectronics Reliability 43 (2003) 371-375, Elsevier Science Ltd., Amsterdam, The Netherlands.
2. Wolter K., Rebenklau L., Hagen G.: Via Formation in LTCC Tape: A Comparison of Technologies, Proc. 1st International Conference on CICMT, April 10-13, 2005, Baltimore/MD.
3. Wang G., Barlow F., Elshabini A.: Interconnection of Fine Lines to Micro Vias in High Density Multilayer LTCC Substrates, Proc. International Symposium on Microelectronics, Sept. 25-29, 2005, Philadelphia/PA.
4. J. Müller, D. Schwanke, T. Haas, E. Feurer, B. Schweizer, A. Klaassen: Improved Design Options and Microwave Performance by Combining Thin Film with LTCC, Workshop Proceedings WS8, 33rd European Microwave Conference, October 6, 2003, Munich.
5. G. Reppe, J. Müller, J. Pohlner, H. Thust, R. Perrone: Development and Evaluation of Fine Line Structuring Methods for Microwave Packages in Satellite Applications, Proc. of 15th European Microelectronics and Packaging Conference & Exhibition, June 12 - 15, 2005, BRUGGE, BELGIUM.
6. Koiwai K. et al.: Low Temperature Co-fired Ceramics Multi- Layer Substrate Utilized with Ink-jet Printed Silver Layers, Proc. International Symposium on Microelectronics, Sept. 25-29, 2005, Philadelphia/PA.
7. Van Tassel J.J., Randall C.A.: Micron Scale Conductors and Integrated Passives in LTCC's by Electrophoretic Deposition, Proc. 1st International Conference on CICMT, April 10-13, 2005, Baltimore/MD.
8. Hagberg J., Kittilä M., Jakku E., Leppävuori S.: Fine Line LTCC-Structures by Direct Gravure Printing (DGP) Method, Proceedings of 35th International Symposium on Microelectronics, Sept. 4-6, 2002, Denver/CO.
9. DuPont Horizons, No. 18, Global edition, Dec. 2001
10. R. Perrone, H. Thust, J. Müller: 3D Interconnection Technology for LTCC RF Modules up to 60 GHz, Proc. 2nd International Conference & Exhibition on Ceramic Interconnect and Ceramic Microsystems, April 24-27, 2006, Denver/CO.
11. Scheel W., Wittke K., Nowottnik M. (Editors): Innovative Produktionsprozesse für die Hochtemperatur-Elektronik am Beispiel der Kfz-Elektroniksysteme, Verlag Dr. Markus A. Detert, Templin, Germany, 2005.
12. Thelemann T.: Die LTCC Technologie als Basis von sensorischen, aktorischen und fluidischen Komponenten für Mikrosysteme, Dissertation, Technische Universität Ilmenau, 2005.
13. Schober A. et al.: A novel class of sensors for system integrative concepts in biotechnological applications, Proc. 12. Heiligenstädter Kolloquium, pp 163-169, 2004, ISBN 3-00- 015042-0