Via formation in LTCC tape: A comparison of technologies

Proceedings - 2005 IMAPS/ACerS 1st International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2005

Volumn , Issue , 2005, Pages 369-376

  Wolter, Klaus Jürgen ^a   Rebenklau, Lars ^a   Hagen, Gunter ^b  

^a DRESDEN UNIVERSITY OF TECHNOLOGY   (Germany)

^b KMS Kemmer Technology Center GmbH   (Germany)

Author keywords

Laser drilling; Low temperature co fired ceramics; LTCC; Punching; Via formation

Indexed keywords

ELECTRICAL PERFORMANCE; EVALUATION CRITERIA; LASER DRILLING; LOW TEMPERATURE CO-FIRED CERAMICS; LTCC; PHOTOIMAGEABLE THICK FILM TECHNOLOGY; TELECOMMUNICATIONS MARKETS; VIA FORMATION;

CERAMIC MATERIALS; EXHIBITIONS; MICROSYSTEMS; PUNCHING; TEMPERATURE; THICK FILMS;

TECHNOLOGY;

EID: 84877739443     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)

1. Jillek, Keller: Handbuch der Leiterplattentechnik, Band IV E. Leuze Verlag 2003.
2. H. Hackiewicz: Technological Evaluation and Reliability of UV Laser MicroVias Proceedings of IMAPS - Europe 2002 in Cracow.
3. E. Müller u.a.: Advanced LTCC-Packaging for optical Sensors Proceedings of IMAPS - Europe 2003 in Friedrichshafen.
4. M. Massiot u.a.: New 3D Possibilities of LTCC Technology Proceedings of IMAPS - Europe 2003 in Friedrichshafen.
5. R. Kulke u.a.: High Level of Integration for Bluetooth Modules on LTCC Proceedings of IMAPS - Europe 2003 in Friedrichshafen.
6. K.-H. Dnie: Laser Processing of LTCC with Different Machine Concepts Proceedings of IMAPS - Europe 2003 in Friedrichshafen.
7. E. Elvey et al: Micro Vias in LTCC Substrates Proceedings of International Symposium on Microelectronics, Long Beach (CA) 2004.
8. NEMI Technology Roadmaps 2002.
9. ITRS Roadmaps 2003.
10. R. Ronniger: Verfahren zur Bearbeituna von Grünfolien und Laminaten Fortsclnittsberichte der Deutschen Keramischen Gesellschaft, Band 18 (2004) Heft.