Interconnection of fine lines to micro vias in high density multilayer LTCC substrates

Proceedings - 2005 International Symposium on Microelectronics, IMAPS 2005

Volumn , Issue , 2005, Pages 810-815

  Wang, Gangqiang ^a   Barlow, Fred ^a   Elshabini, Aicha ^a  

^a University of Arkansas   (United States)

Author keywords

Embedded inductors; Fine lines; Interconnection; Low temperature cofired ceramic (LTCC); Micro vias; Photoimageable paste

Indexed keywords

EMBEDDED INDUCTORS; FINE LINES; INTERCONNECTION; LOW-TEMPERATURE CO-FIRED CERAMICS; MICRO VIAS; PHOTOIMAGEABLE PASTE;

ALIGNMENT; CERAMIC MATERIALS; COPLANAR WAVEGUIDES; MICROELECTRONICS; MULTILAYERS; SILVER; TEMPERATURE;

SUBSTRATES;

EID: 84876916562     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

1. H. Imholf and W. Johnson. (2002, December). Interconnection Substrates-Ceramic, pg. 16. IMAPS Ceramic Interconnect Initiative, DC. Available: http://www.imaps.org/cii/cii-roadmap-2002.pdf
2. Daniel C. Hughes and Steven E. Ernster, "Screen Printed Feature Size Capabilities", Proc. of the 2003 IMAPS Conference and Exhibition on Ceramic Interconnect Technology: The Next Generation, Denver, CO, April 7-9, pp. 58-62, 2003.
3. Michael A. Skursk, Michael A. Smith, Richard R. Draudt, Daniel I. Amey, Samuel J. Horowitz, and Michael J. Cahmp, "Photoimageable Silver Cofireable Conductor Compatible with 951 Green TapeTM", International Journal of Microcircuits and Electronic Packaging, Vol. 21, No. 4, 1998, pp. 355-360.
4. Erica Elvey, Gangqiang Wang, Fred Barlow, and Aicha Elshabini, "Micro Vias in LTCC Substrates", Proc. of the 37th International Symposium on Microelectronics, Nov. 14-18, Long Beach, CA, 2004.
5. E. Elvey, V. Wang, M. Folk, C. Tan, F Barlow, and A. Elshabini, "Process and Material Challenges Associated with the Next Generation of LTCC Based Products", Proceedings of the Electrochemical Society Vol. 2003-27: "Low Temperature Electronics and Low Temperature Cofired Ceramic Based Electronic Devices," Orlando, FL, October 13-16, 2003, pp. 141-155.
6. K. Kautio, "Properties of High Definition Photoimaged Conductors in LTCC", IMAPS Nordic 2002. Available: http://www.vtt.fi//ele/research/ope/ pdf/imapsnordic2002-photoimage.pdf.