Development and evaluation of fine line structuring methods for microwave packages in satellite applications

15th European Microelectronics and Packaging Conference and Exhibition, EMPC 2005 - Conference Programme and Proceedings

Volumn , Issue , 2005, Pages 390-394

  Reppe, G ^a   Muller J ^b   Pohlner, J ^b   Thust, H ^c   Perrone, R ^c  

^a RHe Microsystems GmbH   (Germany)

^b MSE Micro Systems Engineering GmbH & Co   (Germany)

^c ILMENAU UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

Fine line thick film; Lead free; LTCC; Microwave packages; Thermal design; Thin film

Indexed keywords

ALUMINA; ALUMINUM OXIDE; BALL GRID ARRAYS; BINARY ALLOYS; CHIP SCALE PACKAGES; ETCHING; MICROELECTRONICS; MICROWAVES; NITROGEN COMPOUNDS; PACKAGING; SCREEN PRINTING; SUBSTRATES; SURFACE ROUGHNESS; TANTALUM COMPOUNDS; THICK FILMS;

LEAD-FREE; LTCC; MATERIAL COMBINATION; MINISTRY OF EDUCATION; RESEARCH INSTITUTES; SATELLITE APPLICATIONS; THERMAL DESIGNS; THIN FILM CONDUCTORS;

THIN FILMS;

EID: 84876904799     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)

1. st International Conference on Ceramic Interconnect and Ceramic Microsystems Technologies, April 10-13, 2005 Baltimore, MD, USA.
2. rd European Microwave Conference, October 6, 2003, Munich, Germany
3. th European Microelectronics and Packaging Conference, June 23-25, 2003, Friedrichshafen, Germany