Micron scale conductors and integrated passives in LTCC's by electrophoretic deposition

Proceedings - 2005 IMAPS/ACerS 1st International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2005

Volumn , Issue , 2005, Pages 190-193

  Van Tassel, Jonathan J ^a   Randall, Clive A ^a  

^a PENNSYLVANIA STATE UNIVERSITY   (United States)

Author keywords

Electrophoretic deposition; High density interconnect; Integrated passives; LTCC; Nano particles

Indexed keywords

CONVENTIONAL PHOTOLITHOGRAPHY; ELECTROPHORETIC DEPOSITIONS; HIGH DENSITY INTERCONNECTS; INTEGRATED PASSIVES; LOW TEMPERATURE CO-FIRED CERAMICS; LTCC; MICRON-SCALE RESOLUTION; PARTICULATE DEPOSITION;

CERAMIC MATERIALS; DIELECTRIC MATERIALS; ELECTROPHORESIS; EXHIBITIONS; MICROELECTRONICS; MICROSTRIP LINES; MICROSYSTEMS; PHOTOLITHOGRAPHY; SINTERING;

DEPOSITION;

EID: 84877761385     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. M.S.J. Gani, "Electrophoretic Deposition - A Review", Industrial Ceramics Vol. 14 No. 4, p.163, 1994.
2. P. Sarkar and P. S. Nicholson, "Electrophoretic Deposition (EPD): Mechanisms, Kinetics, and Application to Ceramics", J. Am. Ceram. Soc., Vol. 79, No. 8, pp. 1987-2002, 1996.
3. A. Boccaccini and I. Zhitomirsky, Curr. Opin. Solid State Mater. Vol. 6, p. 251, 2002.
4. J. Van Tassel and C.A. Randall, "Potential for integration of electrophoretic deposition into electronic device manufacture; demonstrations using silver/palladium", J. Mater.Sci., Vol. 39, No. 3, pp. 867-880, 2004.