Fine line LTCC-structures by direct gravure printing (DGP) method

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4931, Issue , 2002, Pages 51-56

  Hagberg, Juha ^a   Kittilä, Marko ^a   Jakku, Eino ^a   Leppävuori, Seppo ^a  

^a UNIVERSITY OF OULU   (Finland)

Author keywords

DGP; Direct printing; Fine line; Gravure; LTCC; RF circuits; Thick film

Indexed keywords

ADHESIVE PASTES; CERAMIC MATERIALS; ELECTRODEPOSITION; INTEGRATED CIRCUIT TESTING; MICROWAVE CIRCUITS; NICKEL; POLYSILANES; PRINTING; SUBSTRATES; THICK FILMS;

DIRECT GRAVURE PRINTING METHOD; FINE LINE; LOW TEMPERATURE COFIRED CERAMICS; MICROWAVE TEST CIRCUITS;

MICROELECTRONIC PROCESSING;

EID: 0036451825     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

1. J. Hagberg, M. Pudas, S. Leppävuori, K. Elsey and A. Logan, "Gravure offset printing development for fine line thick film circuits", Microelectronics International, vol. 18, Issue 3, 32-35, 2001.
2. J. Hagberg, M. Kittilä and S. Leppävuori, "Direct Gravure Printing (DGP) Method for Printing Fine Line Electrical Circuits", IMAPS 2001, October 9-11, Baltimore, Maryland, 2001.
3. M. Kittilä J. Hagberg, and S. Leppävuori, "Development of Direct Gravure Printing (DGP) Method for Printing Fine Line Electrical Circuits on LTCC", IMAPS Europe 2002, June 16-18, Cracow, Poland, 2002.
4. J. Hagberg and S. Leppävuori, "Method for the manufacture of high quality gravure plates for printing fine line electrical circuits", Part of the Conference on Device and Process Technologies for MEMS and Microelectronics, Royal Pines Resort Queensland, Australia October 1999 SPIE Vol. 3892, 313-320.
5. M. Pudas, J. Hagberg and S. Leppävuori, "The absorption ink transfer mechanism of gravure offset printing for electronic circuitry", will be published.