In-process verification of MLC substrates

Microelectronics Reliability

Volumn 43, Issue 3, 2003, Pages 371-375

  Muller J ^a   Klein, J ^a   Rayho, J ^b  

^a MSE Micro Systems Engineering GmbH & Co   (Germany)

^b MIDAS Vision Systems   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC MATERIALS; MICROWAVE CIRCUITS; MINIATURE INSTRUMENTS; PRINTED CIRCUIT MANUFACTURE; PRINTED CIRCUIT TESTING; SCREEN PRINTING; SHORT CIRCUIT CURRENTS;

AUTOMATED OPTICAL INSPECTION (AOI); MULTI-LAYERED CERAMICS (MLC);

PRINTED CIRCUIT BOARDS;

EID: 0037371960     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(02)00345-1     Document Type: Conference Paper

References (2)

1. DuPont thick film news: highly-integrated mm-wave modules use LTCC and metallised plastic covers, DuPont Horizons, 2001;18.
2. Hospod T. Increasing yields in high-density MCM-C substrate manufacturing. In: Proceedings of the international conference on high-density interconnect and systems packaging, Santa Clara, CA, 2001. p. 22-5.