Mechanical characterization of lead-free Sn-Ag-Cu solder joints by high-temperature nanoindentation

Journal of Electronic Materials

Volumn 42, Issue 6, 2013, Pages 1085-1091

  Lotfian, S ^a   Molina Aldareguia, J M ^a   Yazzie, K E ^c   Llorca, J ^a,b   Chawla, N ^c  

^a IMDEA MATERIALS INSTITUTE   (Spain)

^b UNIVERSIDAD POLITÉCNICA DE MADRID   (Spain)

^c Arizona State University   (United States)

Author keywords

High temperature nanoindentation; intermetallics; lead free solder; Sn Ag Cu solder

Indexed keywords

ELEVATED TEMPERATURE; HIGH TEMPERATURE; LEAD FREE SOLDERS; MECHANICAL CHARACTERIZATIONS; PB-FREE SOLDER JOINTS; SN-AG-CU LEAD-FREE SOLDERS; SNAGCU SOLDER; TEMPERATURE DEPENDENCE;

COPPER COMPOUNDS; ELASTIC MODULI; EUTECTICS; HARDNESS; INTERMETALLICS; LEAD; NANOINDENTATION; SILVER; SILVER ALLOYS; SOLDERING ALLOYS; TEMPERATURE DISTRIBUTION;

TIN;

EID: 84877778037     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-013-2517-z     Document Type: Article

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