SCOPUS 정보 검색 플랫폼

Proceedings - 2007 International Symposium on Microelectronics, IMAPS 2007

Volumn , Issue , 2007, Pages 758-763

Manufacture and characterization of a novel flip-chip package Z-interconnect stack-up with RF structures

(2) Rowlands, Michael J a Das, Rabindra N a

a EI (Endicott Interconnect Technologies) (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRICAL CHARACTERIZATION; GROUND SIGNAL GROUNDS; INTEGRATED APPROACH; MATERIALS DEVELOPMENT; POLYPHENYLENE ETHERS; POLYTETRAFLUOROETHYLENE (PTFE); S-PARAMETER MEASUREMENTS; SMALL-DIAMETER HOLES;

CHIP SCALE PACKAGES; ELECTRIC LINES; LIQUID CRYSTAL POLYMERS; MICROELECTRONICS; POLYPHENYLENE OXIDES; SCATTERING PARAMETERS; STRIP TELECOMMUNICATION LINES; TRANSMISSION LINE THEORY;

AUTOMOBILE MANUFACTURE;

EID: 84876939347 PISSN: None EISSN: None Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper

Times cited : (9)

References (7)

1
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2
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3
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- May
- th Electronic Components and Technology Conf, May 2006.
- (2006) th Electronic Components and Technology Conf
- Das, R.¹ Egitto, F.² Lauffer, J.³

4
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- Simulation and measurement of high speed serial link performance in a dense, thin core flip chip package
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- (2006) th Electronic Components and Technology Conf
- Rosser, S.¹ Rowlands, M.²

5
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- th Electronic Components and Technology Conf, May 2006.
- (2006) th Electronic Components and Technology Conf
- Audet, J.¹ Cranmer, G.²

6
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- Z-axis interconnection for enhanced wiring in organic laminate electronic packages
- May
- th Electronic Components and Technology Conf, May 2005.
- (2005) th Electronic Components and Technology Conf
- Blackwell, K.¹ Egitto, F.² Krasnak, S.³ Rosser, S.⁴

7
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- Electrical performance of an organic, Z-interconnect, flip-chip substrate
- May
- th Electronic Components and Technology Conf, May 2007.
- (2007) th Electronic Components and Technology Conf
- Das, R.¹ Rowlands, J.²

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.