Electrical performance of an organic, Z-interconnect, flip-chip substrate

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2007, Pages 346-351

  Rowlands, Michael J ^a   Das, Rabindra ^a  

^a EIT (Endicott Interconnect Technologies)   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CONDUCTING JOINTS; DIELECTRIC LAYERS; EMBEDDED RESISTORS; INTERCONNECT BUILDING BLOCKS;

DIELECTRIC MATERIALS; ELECTRIC RESISTANCE; INTERCONNECTION NETWORKS; PARAMETER ESTIMATION; RESISTORS; TELEVISION;

FLIP CHIP DEVICES;

EID: 35348896555     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2007.373821     Document Type: Conference Paper

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