Characterization and FE analysis on the shear test of electronic materials

Microelectronics Reliability

Volumn 44, Issue 12, 2004, Pages 1915-1921

  Gonzalez, M ^a   Vandevelde, B ^a   Van Hoof, R ^a   Beyne, E ^a  

^a IMEC   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

BOUNDARY CONDITIONS; FAILURE ANALYSIS; FINITE ELEMENT METHOD; SHEAR STRENGTH; SHEAR STRESS; STIFFNESS; STRESS CONCENTRATION; SUBSTRATES;

ELECTRONIC MATERIALS; FAILURE MECHANISM; SHEAR TESTING; SHEAR TOOL;

ADHESION;

EID: 6344221955     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2004.04.022     Document Type: Conference Paper

References (9)

1. Xiang Dai, et al. Adhesion measurement for electronic packaging applications using double cantilever beam method. IEEE Trans. Compon. Pack. Technol. 23(1):2000;101-116.
2. Modi M, et al. Effect of adhesive layer properties on interfacial fracture in thin-film high-density interconnects. In: Proceedings of the 52nd Electronic Components and Technology Conference. May 2002. p. 847-53.
3. Schammler G, et al. Shear test for adhesion measurement of small structures. In: Proceedings of the IEEE International Integrated Reliability Workshop. October 1996. p. 31-6.
4. JESD22-B117. BGA ball shear. July 2000, JEDEC Solid State Technology Association.
5. Huang X, et al. Characterization and analysis on the solder ball shear testing conditions. In: Proceedings of the Electronic Components and Technology Conference, 2001.
6. Fan HB, et al. An energy based method to predict delamination in electronic packaging. In: Proceedings of the Electronic Components and Technology Conference, 2002.
7. Beyne E, et al. The use of BCB and photo-BCB dielectrics in MCM-D for high speed digital and microwave applications. In: 4th International Conference & exhibition on Multichip Modules, Denver, Colorado, April 19-21, 1995.
8. Im J, et al. On mechanical reliability of photo-BCB based thin film dielectric polymer for electronic packaging applications. In: Proc. Workshop Mech. Rel. Polymeric Mater. Plastic Packaging. IC Devices, Paris, France, 1998, p. 191.
9. http://www.dow.com/cyclotene/lit.htm. Processing procedures for cyclotene 4000 series resin.