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Advancing Microelectronics
Volumn 29, Issue 1, 2002, Pages
Wire bonding in optoelectronics
Author keywords

[No Author keywords available]
Indexed keywords

ELECTRONICS MANUFACTURERS; PROCESS CAPABILITY; SURFACE METALLIZATION; WIRE BONDING;
EID: 0010828395     PISSN: None     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article
Times cited : (9)
References (3)
  • 1
    • 25144449031 scopus 로고    scopus 로고
    • Step by step: Wire bonding
    • April
    • L. Levine, "Step by Step: Wire Bonding," Advanced Packaging, April 2000
    • (2000) Advanced Packaging
    • Levine, L.1
  • 2
    • 25144443505 scopus 로고    scopus 로고
    • Developing interconnect and connector technologies for a hybrid engine control module
    • M.E. Webster, J.A. Hearn, R.W. Bibby, "Developing Interconnect and Connector Technologies for a Hybrid Engine Control Module," Proc. ISHM 1994, pg 462
    • Proc. ISHM 1994 , pp. 462
    • Webster, M.E.1    Hearn, J.A.2    Bibby, R.W.3
  • 3
    • 0037514217 scopus 로고    scopus 로고
    • Wire bonding optoelectronic packages
    • Nov
    • L. Levine, "Wire Bonding Optoelectronic Packages," Chip Scale Review, Nov 2001
    • (2001) Chip Scale Review
    • Levine, L.1

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.