Crack nucleation during mechanical fatigue in thin metal films on flexible substrates

Acta Materialia

Volumn 61, Issue 9, 2013, Pages 3473-3481

  Kim, Byoung Joon ^a   Shin, Hae A Seul ^a   Jung, Sung Yup ^a   Cho, Yigil ^b   Kraft, Oliver ^c   Choi, In Suk ^b   Joo, Young Chang ^a  

^a Seoul National University   (South Korea)

^b Korea Institute of Science and Technology   (South Korea)

^c KARLSRUHE INSTITUTE OF TECHNOLOGY   (Germany)

Author keywords

Crack; Electrical resistivity; Fatigue; Metal films; Nucleation

Indexed keywords

ELECTRICAL RESISTANCE MEASUREMENT; ELECTRICAL RESISTANCES; ELECTRICAL RESISTIVITY; FLEXIBLE SUBSTRATE; MECHANICAL FATIGUE; METAL FILM; NUMBER OF CYCLES; THIN METAL FILMS;

CRACK PROPAGATION; ELECTRIC CONDUCTIVITY; FATIGUE DAMAGE; FATIGUE OF MATERIALS; METALLIC FILMS; NUCLEATION;

CRACKS;

EID: 84876131759     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.actamat.2013.02.041     Document Type: Article

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