Effect of the film thickness on the fabrication of ordered TiO2 thin film microstructures by transfer printing

Ceramics International

Volumn 39, Issue 4, 2013, Pages 4069-4074

  Lee, Jian Hong ^a   Tsai, Shu Yi ^b   Kuo, Chia Hung ^a   Hon, Min Hsiung ^b   Leu, Ing Chi ^c  

^a INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

^b NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

^c NATIONAL UNIVERSITY OF TAINAN   (Taiwan)

Author keywords

Self assembled monolayer; TiO2 microstructures; Transfer printing

Indexed keywords

3-MERCAPTOPROPYLTRIMETHOXYSILANE; ATTRACTIVE INTERACTIONS; CHEMICALLY BONDED; COATING FILM THICKNESS; CONTINUOUS TIO; FREE-STANDING STRUCTURES; GRID STRUCTURES; LIQUID PHASE DEPOSITIONS (LPD); ORDERED TIO; POLYELECTROLYTE LAYERS; SI SUBSTRATES; THIN FILM MICROSTRUCTURES; THREE-DIMENSIONAL STRUCTURE; TIO; TRANSFER PRINTING; TRANSFER PROCESS; WAFER SURFACE;

FILM THICKNESS; MICROSTRUCTURE; POLYELECTROLYTES; PRINTING; SELF ASSEMBLED MONOLAYERS; SILICON; SILICON WAFERS; SUBSTRATES; THIN FILMS; THREE DIMENSIONAL; VAPOR DEPOSITION;

TITANIUM DIOXIDE;

EID: 84874668035     PISSN: 02728842     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ceramint.2012.10.260     Document Type: Article

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