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Volumn 61, Issue 5, 2013, Pages 1537-1544
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Effects of Si on mechanical properties and microstructure evolution in ultrafine-grained Cu-Si alloys processed by accumulative roll bonding
a
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Author keywords
Accumulative roll bonding (ARB); Copper alloys; Dislocation; Grain boundaries; Severe plastic deformation (SPD)
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Indexed keywords
0.2% PROOF STRESS;
ACCUMULATIVE ROLL BONDING;
BOUNDARY SEPARATION;
DISLOCATION DENSITIES;
DISLOCATION DEPINNING;
GRAIN SIZE;
HIGH VOLTAGE ELECTRON MICROSCOPY;
NORMAL DIRECTION;
PROPERTIES AND MICROSTRUCTURES;
PURE CU;
REASONABLE VALUE;
ROOM TEMPERATURE;
SCANNING TRANSMISSION ELECTRON MICROSCOPY;
SEVERE PLASTIC DEFORMATIONS;
SI ALLOYS;
SI CONCENTRATION;
STRENGTHENING MECHANISMS;
THERMALLY ACTIVATED;
TRANSITION REGIONS;
ULTRA-FINE-GRAINED;
UNIAXIAL TENSILE TEST;
COPPER ALLOYS;
DISLOCATIONS (CRYSTALS);
GRAIN BOUNDARIES;
MECHANICAL PROPERTIES;
MICROSTRUCTURE;
ROLL BONDING;
SILICON;
SINGLE CRYSTALS;
TENSILE TESTING;
TRANSMISSION ELECTRON MICROSCOPY;
SILICON ALLOYS;
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EID: 84873726157
PISSN: 13596454
EISSN: None
Source Type: Journal
DOI: 10.1016/j.actamat.2012.11.031 Document Type: Article |
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Times cited : (25)
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References (37)
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