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Volumn 7, Issue 11, 2007, Pages 3985-3989
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Nanostructured bulk copper fabricated by accumulative roll bonding
a
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Author keywords
Mechanical property; Severe plastic deformation; Ultra fine grained microstructure
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Indexed keywords
(E ,3E) PROCESS;
(O-SEC.-BUTYLDITHIOCARBONATIO-S ,S') COPPER;
ACCUMULATIVE ROLL-BONDING (ARB);
DEFORMED COPPER;
EQUIVALENT STRAINS;
GRAIN SIZES;
HIGH STRENGTH;
LAMELLAR BOUNDARY STRUCTURE;
NANO-STRUCTURED;
NANOSTRUCTURED COPPER;
PROPERTY (S);
SEVERE PLASTIC DEFORMATION (SPD);
STRENGTH (IGC: D5/D6);
STRESS STRAIN CURVE (SSC);
TOTAL ELONGATION (TE);
ULTRAFINE (CO);
UNIFORM ELONGATION (UE);
COPPER;
COPPER ALLOYS;
COPPER METALLOGRAPHY;
DEFORMATION;
ELECTRIC FIELD EFFECTS;
ELONGATION;
EQUIVALENCE CLASSES;
LITHOGRAPHY;
MECHANICAL PROPERTIES;
METAL CLADDING;
METALLIC COMPOUNDS;
MICROSTRUCTURE;
MORPHOLOGY;
OPTICAL DESIGN;
ROLL BONDING;
SHEET METAL;
STRENGTH OF MATERIALS;
STRESS-STRAIN CURVES;
STRESSES;
TENSILE STRENGTH;
ALLOYS;
COPPER;
NANOMATERIAL;
ARTICLE;
CHEMISTRY;
CONFORMATION;
CRYSTALLIZATION;
MACROMOLECULE;
MATERIALS TESTING;
MECHANICAL STRESS;
METALLURGY;
METHODOLOGY;
NANOTECHNOLOGY;
PARTICLE SIZE;
SURFACE PROPERTY;
ULTRASTRUCTURE;
COPPER;
CRYSTALLIZATION;
MACROMOLECULAR SUBSTANCES;
MATERIALS TESTING;
METALLURGY;
MOLECULAR CONFORMATION;
NANOSTRUCTURES;
NANOTECHNOLOGY;
PARTICLE SIZE;
STRESS, MECHANICAL;
SURFACE PROPERTIES;
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EID: 38449111447
PISSN: 15334880
EISSN: None
Source Type: Journal
DOI: 10.1166/jnn.2007.073 Document Type: Conference Paper |
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Times cited : (31)
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References (15)
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