Ultrafine grained copper alloy sheets having both high strength and high electric conductivity

Materials Letters

Volumn 63, Issue 21, 2009, Pages 1757-1760

  Takata, Naoki ^a   Lee, Seong Hee ^b   Tsuji, Nobuhiro ^c  

^a TOKYO INSTITUTE OF TECHNOLOGY   (Japan)

^b Mokpo National University   (South Korea)

^c KYOTO UNIVERSITY   (Japan)

Author keywords

Accumulative roll bonding; Electrical property; Grain size; Mechanical property; Severe plastic deformation

Indexed keywords

ACCUMULATIVE ROLL BONDING; ALLOY SHEETS; CU ALLOY; ELECTRICAL PROPERTY; GRAIN SIZE; HIGH DENSITY; HIGH STRENGTH; SEVERE PLASTIC DEFORMATION; ULTRAFINE-GRAINED; ULTRAFINE-GRAINED COPPER;

ALLOYS; COPPER ALLOYS; ELECTRIC CONDUCTIVITY; ELECTRIC CONDUCTIVITY MEASUREMENT; GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE; MECHANICAL PROPERTIES; PLASTIC DEFORMATION;

ROLL BONDING;

EID: 67649487928     PISSN: 0167577X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matlet.2009.05.021     Document Type: Article

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