Solder paste scooping detection by multilevel visual inspection of printed circuit boards

IEEE Transactions on Industrial Electronics

Volumn 60, Issue 6, 2013, Pages 2318-2331

  Benedek, Csaba ^a,b   Krammer, Olivér ^b   Janoczki, Mihály ^b   Jakab, László ^b  

^a INSTITUTE FOR COMPUTER SCIENCE AND CONTROL   (Hungary)

^b BUDAPEST UNIVERSITY OF TECHNOLOGY AND ECONOMICS   (Hungary)

Author keywords

Marked point process (MPP); printed circuit board (PCB); scooping

Indexed keywords

DIGITAL STORAGE; GLOBAL OPTIMIZATION;

AREA ESTIMATION; BAYESIAN; CIRCUIT ELEMENTS; COMPUTATIONAL REQUIREMENTS; IMAGE DATA; ITS EFFICIENCIES; MARKED POINT PROCESS; MULTIPLE SCALE; OPTIMIZATION PROCESS; POINT PROCESS; PRINTED CIRCUIT BOARD ASSEMBLY; PRINTED CIRCUIT BOARDS (PCB); PRIOR KNOWLEDGE; SCOOPING; SOLDER PASTE; VISUAL INSPECTION;

PRINTED CIRCUIT BOARDS;

EID: 84873673456     PISSN: 02780046     EISSN: None     Source Type: Journal    
DOI: 10.1109/TIE.2012.2193859     Document Type: Article

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