Behavior of solder pastes in stencil printing with vibrating squeegee

IEEE transactions on components, packaging and manufacturing technology. Part C. Manufacturing

Volumn 21, Issue 4, 1998, Pages 317-324

  He, Da ^a   Ekere, N N ^a   Currie, M A ^a  

^a UNIVERSITY OF SALFORD   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; OPTIMIZATION; PARAMETER ESTIMATION; PRINTED CIRCUIT MANUFACTURE; SOLDERING ALLOYS; SURFACE MOUNT TECHNOLOGY; VIBRATIONS (MECHANICAL);

STENCIL PRINTING; VIBRATING SQUEEGEE SYSTEM;

ELECTRONICS PACKAGING;

EID: 0032183357     PISSN: 10834400     EISSN: None     Source Type: None    
DOI: 10.1109/TCPMC.1998.7102530     Document Type: Article

References (12)