Ultra-thin DVS-BCB adhesive bonding of III-V wafers, dies and multiple dies to a patterned silicon-on-insulator substrate

Optical Materials Express

Volumn 3, Issue 1, 2013, Pages 35-46

  Keyvaninia, S ^a   Muneeb, M ^a   Stankovic S ^a   Van Veldhoven, P J ^b   Van Thourhout, D ^a   Roelkens, G ^a  

^a GHENT UNIVERSITY   (Belgium)

^b EINDHOVEN UNIVERSITY OF TECHNOLOGY   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVE LAYER; ADHESIVE BONDING; BONDING PROCEDURE; COLD BONDING; HETEROGENEOUS INTEGRATION; HIGH QUALITY; INTEGRATED PHOTONIC DEVICES; OPTICAL COUPLINGS; SILICON ON INSULATOR WAVEGUIDE; SILICON PHOTONICS; SILICON-ON-INSULATOR SUBSTRATES; SILICON-ON-INSULATORS; SOI WAVEGUIDES; ULTRA-THIN; ULTRA-THIN BONDING LAYERS; WAFER BONDERS; WAFER-SCALE;

BUTENES; DIES; PHOTONIC DEVICES; PHOTONICS; SILICON ON INSULATOR TECHNOLOGY; SILICON WAFERS;

WAFER BONDING;

EID: 84873472913     PISSN: None     EISSN: 21593930     Source Type: Journal    
DOI: 10.1364/OME.3.000035     Document Type: Article

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