Low temperature wafer bonding by spin on glass

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 20, Issue 2, 2002, Pages 752-754

  Lin, H C ^a   Chang, K L ^a   Pickrell, G W ^a   Hsieh, K C ^a   Cheng, K Y ^a  

^a UNIVERSITY OF ILLINOIS AT URBANA CHAMPAIGN   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL MECHANICAL POLISHING; CRYSTAL LATTICES; DISLOCATIONS (CRYSTALS); ETCHING; INTERFACES (MATERIALS); LIGHT EMITTING DIODES; LOW TEMPERATURE EFFECTS; MOLECULAR BEAM EPITAXY; PRESSURE EFFECTS; SCANNING ELECTRON MICROSCOPY; SPIN GLASS; TRANSMISSION ELECTRON MICROSCOPY; VISCOSITY;

VERTICAL-CAVITY SURFACE-EMITTING LASERS (VCSEL);

SILICON WAFERS;

EID: 0036504545     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.1464832     Document Type: Article

References (12)