Die-to-die adhesive bonding procedure for evanescently-coupled photonic devices

Electrochemical and Solid-State Letters

Volumn 14, Issue 8, 2011, Pages

  Stankovi, S ^a   Jones, R ^b   Heck, J ^b   Sysak, M ^b   Van Thourhout, D ^a   Roelkens, G ^a  

^a GHENT UNIVERSITY   (Belgium)

^b INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVE BONDING; BONDING LAYERS; BONDING PROCEDURE; BONDING STRENGTH; BONDING SURFACES; EVANESCENT COUPLING; FABRICATION PROCESS; MOLECULAR BONDING;

DIES; PHOTONIC DEVICES; SILICON WAFERS;

WAFER BONDING;

EID: 79959197648     PISSN: 10990062     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.3592267     Document Type: Article

References (15)

1. D. Van Thourhout, G. Roelkens, R. Baets, W. Bogaerts, J. Brouckaert, P. Debackere, P. Dumon, S. Scheerlinck, J. Schrauwen, D. Taillaert, Semicond. Sci. Technol., 23, 064004 (2008). 10.1088/0268-1242/23/6/064004
2. A.W. Fang, H. Park, R. Jones, O. Cohen, M. J. Paniccia, and J. E. Bowers, IEEE Photonic Technol. Lett., 18, 1143 (2006). 10.1109/LPT.2006.874690
3. J. Van Campenhout, P. Rojo-Romeo, P. Regreny, C. Seassal, D. Van Thourhout, S. Verstuyft, L. Di Cioccio, J.-M. Fedeli, C. Lagahe, and R. Baets, Opt. Express, 15, 6744 (2007). 10.1364/OE.15.006744 (Pubitemid 46827673)
4. H. H. Chang, A. W. Fang, M. N. Sysak, H. Park, R. Jones, O. Cohen, O. Raday, M. J. Paniccia, and J. E. Bowers, Opt. Express, 15, 11466 (2007). 10.1364/OE.15.011466 (Pubitemid 47360581)
5. A. W. Fang, E. Lively, H. Kuo, D. Liang, and J. E. Bowers, Opt. Express, 16, 4413 (2008). 10.1364/OE.16.004413 (Pubitemid 351483405)
6. S. Matsuo, T. Nakahara, K. Tateno, and T. Kurokawa, IEEE Photonic Technol. Lett., 8, 1507 (1996). 10.1109/68.541565
7. F. J. Blanco, M. Agirregabiria, J. Garcia, J. Berganzo, M. Tijero, M. T. Arroyo, J. M. Ruano, I. Aramburu, and K. Mayora, J. Micromech. Microeng., 14, 1047 (2004). 10.1088/0960-1317/14/7/027
8. F. Niklaus, P. Enoksson, E. Kalvesten, and G. Stemme, J. Micromech. Microeng., 11, 100 (2001). 10.1088/0960-1317/11/2/303 (Pubitemid 32266023)
9. G. Roelkens, J. Brouckaert, D. Van Thourhout, R. Baets, R. Ntzel, and M. Smit, J. Electrochem. Soc., 153, G1015 (2006). 10.1149/1.2352045 (Pubitemid 44711562)
10. J. Brouckaert, G. Roelkens, D. Van Thourhout, and R. Baets, J. Lightwave Technol., 25, 1053 (2007). 10.1109/JLT.2007.891172 (Pubitemid 46690935)
11. G. Roelkens, D. Van Thourhout, R. Baets, R. Ntzel, and M. Smit, Opt. Express, 14, 8154 (2006). 10.1364/OE.14.008154 (Pubitemid 44331029)
12. L. Liu, G. Roelkens, J. Van Campenhout, J. Brouckaert, D. Van Thourhout, and R. Baets, J. Nanosci. Nanotechnol., 10, 1461 (2010). 10.1166/jnn.2010.2032
13. http://www.dow.com/cyclotene/prod/302235.htm (Processing Procedures for CYCLOTENE 3000 Series Dry Etch Resins) last accessed: May 5, 2011.
14. S. Stankovic, G. Roelkens, D. Van Thourhout, R. Baets, R. Jones, M. Sysak, and B. Koch, Proceedings of the 13th Annual Symposium IEEE/LEOS Benelux Chapter, IEEE, p. 139 (2008).
15. F. Zimmer, F. Niklaus, M. Lapisa, T. Ludewig, M. Bring, M. Friedrichs, T. Bakke, H. Schenk, and W. van der Wijngaart, Proc. SPIE-Int. Soc. Opt. Eng., 7208, 720807 (2009).