Interface analysis of inorganic films on polyimide with atomic oxygen exposure

Surface and Coatings Technology

Volumn 216, Issue , 2013, Pages 121-126

  Huang, Yongxian ^a   Lv, Shixiong ^a   Tian, Xiubo ^a   Fu, Ricky K Y ^b   Chu, Paul K ^b  

^a HARBIN INSTITUTE OF TECHNOLOGY   (China)

^b CITY UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

Atomic oxygen; Erosion; Inorganic films; Plasma immersion ion implantation deposition; X ray photoelectron spectroscopy

Indexed keywords

ADHESION PROPERTIES; ALUMINA COATING; ANTI-CRACK PERFORMANCE; ATOMIC OXYGEN; ATOMIC OXYGEN EXPOSURE; BONDING STRUCTURE; DEPOSITING PROCESS; EROSION PROPERTIES; GRADED STRUCTURE; INORGANIC FILMS; INTERFACE ANALYSIS; PLASMA IMMERSION ION IMPLANTATION/DEPOSITION; TRANSITION LAYERS;

ADHESION; ALUMINA; ALUMINUM; ALUMINUM COATINGS; ATOMS; COATINGS; EROSION; ION IMPLANTATION; MULTILAYER FILMS; OXYGEN; PHOTOELECTRONS; POLYIMIDES; SILICA; SILICON; X RAY PHOTOELECTRON SPECTROSCOPY;

INTERFACES (MATERIALS);

EID: 84872969307     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2012.11.039     Document Type: Article

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