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33745149335
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Fabrication of tan-gated ultra-thin mosfets (eot < 1. 0nm) with hfo2 using a novel oxygen scavenging process for sub 65nm application
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C. Choi, C. Y. Kang, S. J. Rhee, M. S. Abkar, S. A. Krishna, M. H. Zhang, H. Kim, T. Lee, F. Zhu, I. Ok, S. Koveshnikov, and J. C. Lee, "Fabrication of TaN-gated ultra-thin MOSFETs (EOT
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Koveshnikov, S.11
Lee, J.C.12
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2
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78649947718
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Understanding mobility mechanisms in extremely scaled hfo2 (eot = 0. 42 nm) using remote interfacial layer scavenging technique and v-t-tuning dipoles with gate-first process
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T. Ando, M. M. Frank, K. Choi, C. Choi, J. Bruley, M. Hopstaken, M. Copel, E. Cartier, A. Kerber, A. Callegari, D. Lacey, S. Brown, Q. Yang, and V. Narayanan, "Understanding Mobility Mechanisms in Extremely Scaled HfO2 (EOT = 0. 42 nm) Using Remote Interfacial Layer Scavenging Technique and V-t-tuning Dipoles with Gate-First Process," IEDM Tech. Dig. , pp. 394-397, 2009.
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IEDM Tech. Dig
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Callegari, A.10
Lacey, D.11
Brown, S.12
Yang, Q.13
Narayanan, V.14
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3
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58449122226
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Impact of surface hydrophilicization prior to atomic layer deposition for hfo2/si direct-contact gate stacks
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Y. Morita, A. Hirano, S. Migita, H. Ota, T. Nabatame, and A. Toriumi, "Impact of Surface Hydrophilicization prior to Atomic Layer Deposition for HfO2/Si Direct-Contact Gate Stacks," Appl. Phys. Express, vol. 2, p. 011201, 2009.
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4
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80054955263
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Oxygen-terminated si surface for atomic layer deposition and its impact on interfacial electrical quality of sub-nm-eot high-k gate stacks
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Y. Morita, S. Migita, N. Taoka, W. Misubayashi, and H. Ota, "Oxygen-Terminated Si Surface for Atomic Layer Deposition and its Impact on Interfacial Electrical Quality of sub-nm-EOT high-k Gate Stacks," Ext. Abstr. SSDM, pp. 52-53, 2009.
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Ext. Abstr. SSDM
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Morita, Y.1
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17944362787
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Permittivity increase of yttriumdoped hfo2 through structural phase transformation
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K. Kita, K. Kyuno, and A. Toriumi, "Permittivity increase of yttriumdoped HfO2 through structural phase transformation," Appl. Phys. Lett. , vol. 86, p. 102906, 2005.
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Kita, K.1
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33745463636
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Ultra-thin (eot = 3 angstrom) and low leakage dielectrics of la-alminate directly on si substrate fabricated by high temperature deposition
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M. Suzuki, M. Tomita, T. Yamaguchi, and N. Fukushima, "Ultra-thin (EOT = 3 angstrom) and low leakage dielectrics of La-alminate directly on Si substrate fabricated by high temperature deposition," IEDM Tech. Dig. , pp. 445-448, 2005.
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Suzuki, M.1
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7
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44449155487
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Excellent electrical properties of tio2/hfsio/sio2 layered higher-k gate dielectrics with sub-1?nm equivalent oxide thickness
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H. Arimura, N. Kitano, Y. Naitou, Y. Oku, T. Minami, M. Kosuda, T. Hosoi, T. Shimura, and H. Watanabe, "Excellent electrical properties of TiO2/HfSiO/SiO2 layered higher-k gate dielectrics with sub-1?nm equivalent oxide thickness," Appl. Phys. Lett. , vol. 92, p. 212902, 2008.
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8
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51949115747
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Design and demonstration of very high-k (k > 50) hfo2 for ultra-scaled si cmos
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S. Migita, Y. Watanabe, H. Ota, H. Ito, Y. Kamimuta, T. Nabatame, and A. Toriumi, "Design and demonstration of very high-k (k > 50) HfO2 for ultra-scaled si CMOS," Symp. VLSI Tech. Dig. , pp. 152-153, 2008.
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Migita, S.1
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9
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67349116358
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Scaling the mosfet gate dielectric: From high-k to higher-k+ (invited paper)
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M. M. Frank, S. Kim, S. L. Brown, J. Bruley, M. Copel, M. Hopstaken, M. Chudzik, and V. Narayanan, "Scaling the MOSFET gate dielectric: From high-k to higher-k+ (Invited Paper)," Microelectron. Eng. , vol. 86, pp. 1603-1608, 2009.
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10
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80054910865
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Direct-contact higher-k hfo2 gate stacks by oxygen-controlled cap-post deposition annealing
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Y. Morita, S. Migita, W. Mizubayashi, and H. Ota, "Direct-contact higher-k HfO2 gate stacks by oxygen-controlled cap-post deposition annealing," Jpn. J. Appl. Phys. , vol. 50, p. 10PG01, 2011.
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Morita, Y.1
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84857463128
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Extremely scaled (~0. 2 nm) equivalent oxide thickness of higher-k (k = 40) hfo2 gate stacks prepared by atomic layer deposition and oxygencontrolled cap post-deposition annealing
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Y. Morita, S. Migita, W. Mizubayashi, and H. Ota, "Extremely scaled (~0. 2 nm) equivalent oxide thickness of higher-k (k = 40) HfO2 gate stacks prepared by atomic layer deposition and oxygencontrolled cap post-deposition annealing," Jpn. J. Appl. Phys. , vol. 51, p. 02BA04, 2012.
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Jpn. J. Appl. Phys.
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Morita, Y.1
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12
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78650571575
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Experimental demonstration of higher-k phase hfo2 through non-equilibrium thermal treatment
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Y. Nakajima, K. Kita, T. Nishimura, K. Nagashio, and A. Toriumi, "Experimental Demonstration of Higher-k Phase HfO2 Through Non-Equilibrium Thermal Treatment," ECS Trans. , pp. 203-212, 2010.
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Nakajima, Y.1
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13
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84910030533
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Reliable extractions of eot and vfb in poly-si gate high-k misfets through advanced modeling of gate and substrate capacitances
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N. Yasuda, H. Ota, T. Horikawa, T. Nabatame, H. Satake, A. Toriumi, Y. Tamura, T. Sasaki, and F. Ootsuka, "Reliable Extractions of EOT and Vfb in Poly-Si Gate High-k MISFETs through Advanced Modeling of Gate and Substrate Capacitances," Ext. Abstr. SSDM, pp. 250-251, 2005.
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