Combined effect of nanoscale grain size and porosity on lattice thermal conductivity of bismuth-telluride-based bulk alloys

Journal of Applied Physics

Volumn 112, Issue 8, 2012, Pages

  Takashiri, Masayuki ^a   Tanaka, Saburo ^b   Hagino, Harutoshi ^b   Miyazaki, Koji ^b  

^a TOKAI UNIVERSITY   (Japan)

^b KYUSHU INSTITUTE OF TECHNOLOGY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

AVERAGE GRAIN SIZE; BULK ALLOYS; COMBINED EFFECT; COMBINED MODEL; EXPERIMENTAL STUDIES; GAIN INSIGHT; GRAIN SIZE; GRAIN SIZE EFFECT; LASER FLASH METHODS; LATTICE THERMAL CONDUCTIVITY; MAXWELL-GARNETT MODELS; NANO SCALE; NANO-POROUS; NANOCRYSTALLINES; NANOSCALE CRYSTALS; NANOSCALE REGIME; PHONON TRANSPORT; PHONON TRANSPORT MODELS; POROSITY EFFECT; ROOM TEMPERATURE;

BISMUTH; BISMUTH ALLOYS; CERIUM ALLOYS; CRYSTAL LATTICES; GRAIN SIZE AND SHAPE; NANOTECHNOLOGY; PHONONS; POROSITY; THERMAL CONDUCTIVITY;

NANOCRYSTALLINE ALLOYS;

EID: 84868342472     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.4759326     Document Type: Article

References (35)

1. F. J. DiSalvo, Science 285, 703 (1999). 10.1126/science.285.5428.703
2. H. J. Goldsmid, Materials Used in Semiconductor Devises, edited by, C. A. Hogarth, (Wiley, New York, 1965).
3. B. Poudel, Q. Hao, Y. Ma, Y. Lan, A. Minnich, B. Yu, X. Yan, D. Wang, A. Muto, D. Vashaee, X. Chen, J. Liu, M. S. Dresselhaus, G. Chen, and Z. Ren, Science 320, 634 (2008). 10.1126/science.1156446
4. M. Takashiri, K. Miyazaki, S. Tanaka, J. Kurosaki, D. Nagai, and H. Tsukamoto, J. Appl. Phys. 104, 084302 (2008). 10.1063/1.2990774
5. C. N. Liao, Y. C. Wang, and H. S. Chu, J. Appl. Phys. 104, 104312 (2008). 10.1063/1.3026728
6. H. Obara, S. Higomo, M. Ohta, A. Yamamoto, K. Ueno, and T. Iida, Jpn. J. Appl. Phys. 48, 085506 (2009). 10.1143/JJAP.48.085506
7. C. Dames and G. Chen, J. Appl. Phys. 95, 682 (2004). 10.1063/1.1631734
8. Q. Hao, G. Zhu, G. Joshi, X. Wang, A. Minnich, Z. Ren, and G. Chen, Appl. Phys. Lett. 97, 063109 (2010). 10.1063/1.3478459
9. D. W. Song, W.-N. Shen, B. Dunn, C. D. Moore, M. S. Goorsky, T. Radetic, R. Gronsky, and G. Chen, Appl. Phys. Lett. 84, 687 (2004). 10.1063/1.1642753
10. T. Hamachiyo, M. Ashida, and K. Hasezaki, J. Electron. Mater. 38, 1048 (2009). 10.1007/s11664-009-0718-2
11. Y. H. Zhang, G. Y. Xu, F. Han, Z. Wang, and C. C. Ge, J. Electron. Mater. 39, 1741 (2010). 10.1007/s11664-010-1199-z
12. M. Kashiwagi, S. Hirata, K. Harada, Y. Zheng, K. Miyazaki, M. Yahiro, and C. Adachi, Appl. Phys. Lett. 98, 023114 (2011). 10.1063/1.3543852
13. N. Mingo and D. A. Broido, J. Appl. Phys. 101, 014322 (2007). 10.1063/1.2405232
14. J.-H. Lee, J. C. Grossman, J. Reed, and G. Galli, Appl. Phys. Lett. 91, 223110 (2007). 10.1063/1.2817739
15. C. Bera, N. Mingo, and S. Volz, Phys. Rev. Lett. 104, 115502 (2010). 10.1103/PhysRevLett.104.115502
16. Z. Wang, J. E. Alaniz, W. Jang, J. E. Garay, and C. Dames, Nano Lett. 11, 2206 (2011). 10.1021/nl1045395
17. M. Takashiri, S. Tanaka, M. Takiishi, M. Kihara, K. Miyazaki, and H. Tsukamoto, J. Alloys Compd. 462, 351 (2008). 10.1016/j.jallcom.2007.08.054
18. M. Takashiri, T. Shirakawa, K. Miyazaki, and H. Tsukamoto, J. Alloys Compd. 441, 246 (2007). 10.1016/j.jallcom.2006.09.136
19. H. Kaibe, Y. Tanaka, M. Sakata, and I. Nishida, J. Phys. Chem. Solids 50, 945 (1989). 10.1016/0022-3697(89)90045-0
20. C. Chiritescu, D. G. Cahill, C. Mortensen, D. Johnson, and P. Zschack, J. Appl. Phys. 106, 073503 (2009). 10.1063/1.3226884
21. J. Callaway, Phys. Rev. 113, 1046 (1959). 10.1103/PhysRev.113.1046
22. S. Tanaka, M. Takashiri, and K. Miyazaki, in Proceedings of International Heat Transfer Conference (ASME, New York, 2010), p. 873.
23. B. Abeles, Phys. Rev. 131, 1906 (1963). 10.1103/PhysRev.131.1906
24. Y.-J. Han, Phys. Rev. B 54, 8977 (1996). 10.1103/PhysRevB.54.8977
25. L. W. da Silva and M. Kaviany, Int. J. Heat Mass Transfer 47, 2417 (2004). 10.1016/j.ijheatmasstransfer.2003.11.024
26. C. Kim, D.-H. Kim, Y.-S. Han, J.-S. Chung, S.-H. Park, S. Park, and H. Kim, Mater. Res. Bull. 46, 407 (2011). 10.1016/j.materresbull.2010.12.004
27. T. Kajihara, K. Fukuda, Y. Sato, and M. Kikuchi, in Proceedings of 17th International Conference on Thermoelectrics (IEEE, New York, 1998), p. 129.
28. A. Mavrokefalos, A. L. Moore, M. T. Pettes, L. Shi, W. Wang, and X. Li, J. Appl. Phys. 105, 104318 (2009). 10.1063/1.3133145
29. J. C. Maxwell-Garnett, Philos. Trans. R. Soc. London 203, 385 (1904). 10.1098/rsta.1904.0024
30. H. Szelagowski, I. Arvanitidis, and S. Seetharaman, J. Appl. Phys. 85, 193 (1999). 10.1063/1.369468
31. K. Miyazaki, T. Arashi, D. Makino, and H. Tsukamoto, IEEE Trans. Compon. Packag. Manuf. Technol., Part A 29, 247 (2006). 10.1109/TCAPT.2006.875905
32. G. S. Nolas, J. Sharp, and H. J. Goldsmid, Thermoelectrics (Springer, Berlin, 2001).
33. D. G. Cahill, S. K. Watson, and R. O. Pohl, Phys. Rev. B 46, 6131 (1992). 10.1103/PhysRevB.46.6131
34. E. A. Mityushov, R. A. Adamesku, and P. V. Geld, J. Eng. Phys. 47, 1052 (1984). 10.1007/BF00873718
35. F. Yang, T. Ikeda, G. J. Snyder, and C. Dames, J. Appl. Phys. 108, 034310 (2010). 10.1063/1.3457334