Measurement of the high-temperature Seebeck coefficient of thin films by means of an epitaxially regrown thermometric reference material

Review of Scientific Instruments

Volumn 83, Issue 9, 2012, Pages

  Ramu, Ashok T ^a   Mages, Phillip ^a   Zhang, Chong ^a   Imamura, Jeffrey T ^a   Bowers, John E ^a  

^a University of California   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BOLTZMANN TRANSPORT EQUATION; FIGURE OF MERITS; HIGH TEMPERATURE; INP; LATTICE-MATCHED; MATERIAL SYSTEMS; MATERIAL UNDER TESTS; REFERENCE MATERIAL; RIGOROUS SOLUTION; TEMPERATURE DIFFERENCES; TEMPERATURE RANGE; THERMAL CONTACT; THERMOELECTRIC MATERIAL; THREE TEMPERATURE;

CONVERSION EFFICIENCY; THERMOCOUPLES; THERMOELECTRIC ENERGY CONVERSION;

SEEBECK COEFFICIENT;

EID: 84866975843     PISSN: 00346748     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.4754714     Document Type: Review

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