Measurement and simulation of the pull-off strength at the separation of miniaturized 3D connectors consisting of silicon masters with undercuts and PDMS replicas

Microelectronic Engineering

Volumn 101, Issue , 2013, Pages 31-36

  Zajadacz, J ^a   Lorenz, P ^a   Ehrhardt, M ^a   Zimmer, K ^a   Mollenbeck S ^b   Dhima, K ^b   Scheer, H C ^b  

^a LEIBNIZ INSTITUTE OF SURFACE ENGINEERING IOM   (Germany)

^b UNIVERSITY OF WUPPERTAL   (Germany)

Author keywords

FEM simulation; Force displacement measurement; Moulding; PDMS; Undercut 3D patterns

Indexed keywords

FEM SIMULATIONS; FINITE ELEMENT MODELLING; FORCE-DISPLACEMENT; LAB ON CHIP; LINEAR ELASTIC MODEL; LOCAL DISTRIBUTIONS; MEASUREMENT AND SIMULATION; MICRON LEVEL; MICROTECHNOLOGY; PDMS; PDMS REPLICA; PULL-OFF; QUANTITATIVE RESULT; RETENTION FORCE; STRESS AND STRAIN; TENSILE FORCES; UNDERCUT 3D PATTERNS;

DISPLACEMENT MEASUREMENT; FINITE ELEMENT METHOD; LOADING; MICROCHANNELS; MOLDING; SILICONES; STRESS ANALYSIS;

THREE DIMENSIONAL COMPUTER GRAPHICS;

EID: 84866883188     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2012.08.024     Document Type: Article

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