3D-Hot embossing of undercut structures - An approach to micro-zippers

Microelectronic Engineering

Volumn 73-74, Issue , 2004, Pages 190-195

  Bogdanski, N ^a   Schulz, H ^a   Wissen, M ^a   Scheer, H C ^a   Zajadacz, J ^b   Zimmer, K ^b  

^a UNIVERSITY OF WUPPERTAL   (Germany)

^b LEIBNIZ INSTITUTE OF SURFACE ENGINEERING IOM   (Germany)

Author keywords

3D structures; Hot embossing; Micro zipper; Nanoimprint; PDMS

Indexed keywords

ANISOTROPY; COMPUTER CONTROL; CURING; ION BEAMS; LASER ABLATION; LOW TEMPERATURE EFFECTS; MOLECULAR STRUCTURE; PLASTIC FILMS; REACTIVE ION ETCHING; THERMOPLASTICS;

3D-STRUCTURES; HOT EMBOSSING PROCESS; MICRO-ZIPPERS; NANOIMPRINTS; PDMS;

NANOTECHNOLOGY;

EID: 17344379801     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0167-9317(04)00097-8     Document Type: Conference Paper

References (12)

1. Chou S.Y., Krauss P.R., Rennstrom P.J. Appl. Phys. Lett. 67:1995;3114 Chou S.Y., Krauss P.R., Rennstrom P.J. J. Vac. Sci. Technol. B. 14:1996;4129.
2. Chou S.Y., Krauss P.R., Rennstrom P.J. Appl. Phys. Lett. 67:1995;3114 Chou S.Y., Krauss P.R., Rennstrom P.J. J. Vac. Sci. Technol. B. 14:1996;4129.
3. Xia Y., McClelland J.J., Gupta R., Qin D., Zhao X.-M., Sohn L.L., Celotta R., Whitesides G.M. Adv. Mater. 9:1997;147 Xia Y., Qin D., Whitesides G.M. Adv. Mater. 8:1996;1015.
4. Xia Y., McClelland J.J., Gupta R., Qin D., Zhao X.-M., Sohn L.L., Celotta R., Whitesides G.M. Adv. Mater. 9:1997;147 Xia Y., Qin D., Whitesides G.M. Adv. Mater. 8:1996;1015.
5. Colburn M., Johnson S., Stewart M., Damle S., Barley T., Choi B., Wedlake M., Michelson T., Sreenivasan S.V., Ekerdt J., Wilson C.G. Proc. SPIE. 3676:1999;379.
6. Zimmer K., Otte K., Braun A., Rudschuk St., Friedrich H., Schulz H., Scheer H.-C., Hoffmann T., Sotomayor-Torres C.M., Mehnert R., Bigl F. Proc. EUSPEN. 1:1999;534 Gower M.C., et al. Proc. SPIE. 3618:1999;251.
7. Zimmer K., Otte K., Braun A., Rudschuk St., Friedrich H., Schulz H., Scheer H.-C., Hoffmann T., Sotomayor-Torres C.M., Mehnert R., Bigl F. Proc. EUSPEN. 1:1999;534 Gower M.C., et al. Proc. SPIE. 3618:1999;251.
8. Odom T.W., Love J.C., Wolfe D.B., Paul K.E., Whitesides G.M. Langmuir. 18:2002;5314.
9. Schulz H., Brehmer M., Zajadacz J., Zimmer K., Scheer H.-C. 4th Ceasarium. 2003;Caesar, Bonn.
10. Roos N., Schulz H., Fink M., Pfeiffer K., Osenberg F., Scheer H.-C. Proc. SPIE. 4688:2002;232.
11. Schulz H., Wissen M., Scheer H.-C. Microelectron. Eng. 67-68:2003;657.
12. Rudschuck St., Rudschuck St., Hirsch D., Zimmer K., Otte K., Braun A., Mehnert R., Bigl F. Microel. Eng. 53:2000;557.