High density compliant contacting technology for integrated high power modules in automotive applications

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2012, Pages 1976-1983

  Nenzi, Paolo ^a   Crescenzi, Rocco ^a   Dolgyi, Alexander ^b   Klyshko, Alexy ^b   Bondarenko, Vitaly ^b   Belfiore, Nicola Pio ^a   Balucani, Marco ^a  

^a SAPIENZA UNIVERSITY OF ROME   (Italy)

^b BELARUSIAN STATE UNIVERSITY OF INFORMATICS AND RADIOELECTRONICS   (Belarus)

Author keywords

[No Author keywords available]

Indexed keywords

AUTOMOTIVE APPLICATIONS; BOND WIRE; COMPLIANT CONTACTS; CONTACT STRUCTURE; CONTACTING TECHNOLOGY; CONTROL CIRCUITRY; ELECTRICAL PERFORMANCE; HIGH DENSITY; HIGH POWER MODULE; MICROELECTROMECHANICS; POWER CYCLE; POWER DEVICES; POWER ELECTRONIC APPLICATIONS; PROCESS CONDITION; TEST STRUCTURE; WIRE BONDING;

ALUMINUM; AUTOMOTIVE INDUSTRY; ELECTRIC POWER SYSTEMS;

TECHNOLOGY;

EID: 84866879226     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2012.6249111     Document Type: Conference Paper

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