Packaging and interconnection technologies of power devices, challenges and future trends

World Academy of Science, Engineering and Technology

Volumn 37, Issue , 2009, Pages 691-694

  Amro, Raed A ^a  

^a Department of Computer and Electrical Engineering   (Palestine)

Author keywords

Low temperature joining technique (LTJT); Power cycling; Power electronics devices; Reliability

Indexed keywords

FAILURE MECHANISM; FUTURE APPLICATIONS; FUTURE TRENDS; INTERCONNECTION TECHNOLOGY; JUNCTION TEMPERATURES; LOW-TEMPERATURE JOINING TECHNIQUE (LTJT); NEW APPLICATIONS; POWER CYCLING; POWER DEVICES; POWER ELECTRONICS DEVICES; SOLDER LAYERS; THERMAL DEMANDS;

ELECTRIC EQUIPMENT; JOINING; POWER ELECTRONICS; RELIABILITY;

ELECTRONIC EQUIPMENT MANUFACTURE;

EID: 78651308345     PISSN: 2010376X     EISSN: 20103778     Source Type: Journal    
DOI: None     Document Type: Article

References (6)

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2. AUERBACH; SCHWARZBAUER; LAMMERS; LENNIGER: Zuverlässigkeit von Al-Dickdraht-Bondverbindungen. ISHM Konferenz, München 1996.
3. M. RODRIGUES; N. SHAMMAS; N. PLUMPTON; D. NEWCOMBE; D. CREES: Static and Dynamic Finite Element Modelling of Thermal Fatigue Effects in IGBT Modules. Microelectronics Reliability 40(2000), pp. 455-463. B. Smith, "An approach to graphs of linear forms (Unpublished work style)," unpublished.
4. M.-H. POECH: Schädigungsmechanismen in Lötverbindungen bei erhöhter Temperatur. VTE 14 (2002), Heft1, S. 12-18.
5. H. SCHWARZBAUER; R. KUHNERT: Novel Large Area Joining Technique for Improved Power Device Performance. IEEE Transactions on Industry Applications, Vol.27, pp. 93-95, 1991.
6. C. PANZER; T. PASSE; T. STOLZE; Z. LIANG: Clamping Technique improves IGBT Installation. PET magazine, Oct. Issue 56(2002).