Fully analytical methodology for fast end-to-end link analysis on complex printed circuit boards including signal and power integrity effects

Designcon 2009

Volumn 3, Issue , 2009, Pages 1450-1467

  Gu, Xiaoxiong ^a   De Paulis, Francesco ^b   Rimolo Donadio, Renato ^c   Shringarpure, Ketan ^d   Zhang, Yaojiang ^e   Archambeault, Bruce ^f   Connor, Sam ^f   Kwark, Young H ^a   Ritter, Mark B ^a   Fan, Jun ^d   Schuster, Christian ^c  

^a IBM T J WATSON RESEARCH CENTER   (United States)

^b UNIVERSITY OF L'AQUILA   (Italy)

^c HAMBURG UNIVERSITY OF TECHNOLOGY   (Germany)

^d MISSOURI UNIVERSITY OF SCIENCE AND TECHNOLOGY   (United States)

^e INSTITUTE OF HIGH PERFORMANCE COMPUTING   (Singapore)

^f IBM   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ANALYTICAL APPROACH; ANALYTICAL METHODOLOGY; FULL-WAVE ELECTROMAGNETIC FIELD SOLVER; FULL-WAVE SIMULATIONS; LINK ANALYSIS; POWER INTEGRITY; RAPID ANALYSIS;

ELECTROMAGNETIC FIELDS; POLYCHLORINATED BIPHENYLS;

PRINTED CIRCUIT BOARDS;

EID: 84866400847     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (16)

1. S. Chun, A. Haridass, C. O'Reilly, "Efficient Modeling of Simultaneous Switching Noise in a Realistic Computer System", IEEE Topical Meeting on Electronic Performance of Electronic Packaging (EPEP), Princeton, NJ, 2003.
2. J. Fang, Y. Liu, Y. Chen, Z. Wu, A. Agrawal, "Modeling of Power/Ground Plane Noise in High Speed Digital Electronics Packaging", IEEE Topical Meeting on Electrical Performance of Electronic Packaging (EPEP), Monterey, CA, 1993.
3. J. Fang, Y. Chen, Z. Wu, D. Xue, "Model of Interaction Between Signal Vias and Metal Planes in Electronics Packaging", IEEE Topical Meeting on Electrical Performance of Electronic Packaging (EPEP), Monterey, CA, 1994.
4. Q. Gu, E. Yang, M. A. Tassoudji, "Modeling of Vias in Multilayered Integrated Circuits", IEEE Transactions on Microwave Theory and Techniques, vol. 41, no. 2, pp. 206-214, February 1993.
5. Q. Gu, M. A. Tassoudji, S. Y. Poh, R. T. Shin, J. A. Kong, "Coupled Noise Analysis for Adjacent Vias in Multilayered Digital Circuits", IEEE Transactions on Circuits and Systems - Part I, vol. 41, no. 12, pp. 796-804, December 1994.
6. R. Ito, R. W. Jackson, T. Hongsmatip, "Modeling of Interconnections and Isolation Within a Multilayered Ball Grid Array Package", IEEE Transactions on Microwave Theory and Techniques, vol. 47, no. 9, pp. 1819-1825, September 1999.
7. T. Kushta, K. Narita, T. Kaneko, T. Saeki, H. Tohya "Resonance Stub Effect in a Transition From a Through Via Hole to a Stripline in Multilayer PCB", IEEE Wireless Components Letters, vol. 13, no. 5, pp. 169-171, May 2003.
8. C. Schuster, Y. Kwark, G. Selli, P. Muthana, "Developing a physical model for vias", Proceedings IEC DesignCon, Santa Clara, CA, USA, February 2006.
9. G. Selli, C. Schuster, Y. Kwark, M. Ritter, and J. Drewniak, "Developing a physical model for vias: part 2. Coupled and ground return vias," Proceedings IEC DesignCon, Santa Clara, CA, February 2007.
10. X. Gu and M. Ritter, "Application of Foldy-Lax multiple scattering method to via analysis in multilayer printed circuit board," Proceedings IEC DesignCon, Santa Clara, CA, February 2008.
11. R. Rimolo-Donadio, A. J. Stepan, H. Brims, J. L. Drewniak, C. Schuster, "Simulation of via interconnects using physics-based models and microwave network parameters," Proc. 12th IEEE Workshop on Signal Propagation on Interconnects, Avignon, France, May 2008.
12. Y. Zhang, J. Fan, G. Selli, M. Cocchini, and D. P. Francesco, "Analytical Evaluation of Via-Plate Capacitance for Multilayer Printed Circuit Boards and Packages," IEEE Transactions on Microwave Theory and Techniques, vol. 56, no. 9, pp. 2118 - 2128, September 2008.
13. T. Okoshi, T. Miyodhi, "The planar circuit - an approach to microwave integrated circuitry," IEEE Transaction on Microwave Theory and Techniques, vol. 20, no. 4, pp. 245-252, April 1972.
14. Y. Zhang, F. Gang, and J. Fan, "Radial Waveguide Interpretation of the Impedance of Power/Ground Planes and its Evaluation by Boundary Integral Method", prepared for IEEE Transactions on Microwave Theory and Techniques, 2008.
15. A. E. Engin, W. John, G. Sommer, W. Mathis, and H Reichl, "Modeling of Striplines Between a Power and a Ground Plane", IEEE Transactions on Advanced Packaging, vol. 29, no. 3, pp. 415-426, August 2006.
16. CZ2D® website: http.7Av3.rcsearch.ibm.com/cm/cnti/eiptools/cz2cl.html