Integration of microelectronic chips in microfluidic systems on printed circuit board

Journal of Micromechanics and Microengineering

Volumn 22, Issue 10, 2012, Pages

  Burdallo, I ^a   Jimenez Jorquera, C ^a   Fernandez Sanchez C ^a   Baldi, A ^a  

^a UNIVERSITAT AUTÒNOMA DE BARCELONA   (Spain)

Author keywords

[No Author keywords available]

Indexed keywords

BISPHENOL A; BONDED STRUCTURE; DIACRYLATES; EDGE SURFACE; ENCAPSULANT MATERIALS; FLAT AREA; INTEGRATION PROCEDURE; INTEGRATION SCHEME; INTER-DIGITATED ELECTRODES; ION-SELECTIVE FIELD EFFECT TRANSISTORS; LEAKAGE TESTS; LOW COST FABRICATION; MICRO FLUIDIC SYSTEM; MICROELECTRONIC CHIP; MICROFLUIDIC STRUCTURES; MODERATE TEMPERATURE; PACKAGING TECHNIQUES; PHOTOCURABLE; SILICON MICROTECHNOLOGY;

FIELD EFFECT TRANSISTORS; FLUIDIC DEVICES; INTEGRATION; MICROELECTRONICS; MICROFLUIDICS; PRINTED CIRCUIT BOARDS; SILICONES; TRANSDUCERS;

CHIP SCALE PACKAGES;

EID: 84866339126     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/22/10/105022     Document Type: Article

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