A low temperature surface modification assisted method for bonding plastic substrates

Journal of Micromechanics and Microengineering

Volumn 19, Issue 1, 2009, Pages

  Vlachopoulou, M E ^a   Tserepi, A ^a   Pavli, P ^a   Argitis, P ^a   Sanopoulou, M ^b   Misiakos, K ^a  

^a INSTITUTE OF MICROELECTRONICS   (Greece)

^b Institute of Physical Chemistry   (Greece)

Author keywords

[No Author keywords available]

Indexed keywords

GLASS BONDING; MICROCHANNELS; PHOTORESISTS; POLYSTYRENES; SILANES; SILICONES; SURFACE TREATMENT;

GENERIC METHODS; LOW COSTS; LOW TEMPERATURES; LOW-TEMPERATURE PROCESS; MICRO-FLUIDIC DEVICES; ORGANIC SUBSTRATES; PLASTIC SUBSTRATES; POLIES (METHYLMETHACRYLATE); POLYDIMETHYLSILOXANE PDMS; POLYMERIC SUBSTRATES; SILANE SOLUTIONS; SURFACE MODIFICATIONS;

SUBSTRATES;

EID: 62649094911     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/19/1/015007     Document Type: Article

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