ISFET CMOS compatible design and encapsulation challenges

11th IEEE International Conference on Electronics, Circuits and Systems, ICECS 2004

Volumn , Issue , 2004, Pages 535-538

  Sudakov Boreysha, Liby ^a   Morgenshtein, Arkadiy ^a   Dinnar, Uri ^a   Nemirovsky, Yael ^a  

^a TECHNION ISRAEL INSTITUTE OF TECHNOLOGY   (Israel)

Author keywords

CMOS; Encapsulation; Flip chip bonding; ISFET; SU8

Indexed keywords

ELECTRONICS PACKAGING; FIELD EFFECT TRANSISTORS; FLIP CHIP DEVICES; MICROPROCESSOR CHIPS; CHIP SCALE PACKAGES; INTEGRATED CIRCUIT DESIGN;

ENCAPSULATION; FLIP-CHIP BONDING; ISFET; SU8;

CMOS INTEGRATED CIRCUITS;

CMOS; CMOS COMPATIBLE; COMPATIBLE DESIGN; ENCAPSULANTS; FLIP-CHIP-BONDING;

EID: 27644446042     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

1. "Ion Sensitive Field Effect Transistors in Standard CMOS for Brain Monitoring", Research thesis, Claudio. G. Jakobson.
2. "Analytical and Biomedical Applications of Ion-Selective Field-Effect Transistors", P. Bergveld, A Sibbald.
3. "Encapsulation of Chemically sensitive Field-Effect Transistors with photo curable Epoxy Resins." C Dumschat.
4. "Improving the Process Capability of SU-8", M. Shaw, D. Nawrocki, R. Hurditch and D. Johnson, MicroChem Corp.
5. "ISFET integrated sensor technology", Sensors and Actuators, Pavel Neuzil.
6. http://aveclafaux.freeservers.com/SU-8.html