Simultaneous analysis of residual stress and stress intensity factor in a resist after UV-nanoimprint lithography based on electron moiré fringes

Journal of Micromechanics and Microengineering

Volumn 22, Issue 10, 2012, Pages

  Wang, Qinghua ^a   Kishimoto, Satoshi ^a  

^a NATIONAL INSTITUTE FOR MATERIALS SCIENCE   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

DISPLACEMENT DISTRIBUTION; DISPLACEMENT EXTRAPOLATION METHOD; GRID QUALITY; INDUCED CRACK; MICRO GRID; RESIDUAL STRAINS; RESIST FILMS; SIMULTANEOUS ANALYSIS; TRIANGULAR ARRANGEMENTS; ULTRAVIOLET-NANOIMPRINT LITHOGRAPHY; UV NANOIMPRINT LITHOGRAPHY;

CRACKS; ELECTRONS; FABRICATION; RESIDUAL STRESSES; STRESS INTENSITY FACTORS;

NANOIMPRINT LITHOGRAPHY;

EID: 84866315683     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/22/10/105021     Document Type: Article

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